FR1 , CEM3 , Ceramic main control board pcb assembly 1oz ~ 4oz ENIG Finish
Brand Name:BangBane
Certification:UL,SGS,ROHS,ISO
Minimum Order Quantity:100pcs
Delivery Time:7-15days
Payment Terms:L/C,D/A,D/P,T/T,Western Union,MoneyGram,Paypal
Place of Origin:ShenZhen
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Location:
Shenzhen Guangdong
Address:
810-818#, Yufeng building,6-9# Jinhai road, Yantian community,Xixiang street,Bao'an district, Shenzhen city
Supplier`s last login times:
within 48 hours
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Product Details
FR1 , CEM3 , Ceramic main control board pcb assembly 1oz ~ 4oz ENIG Finish
Quick Details
| Place of Origin: | China (Mainland) | Brand Name: | OEM | Model Number: | JY PCB |
| Base Material: | FR4,FR1,CEM3, Aluminum,Ceramic | Copper Thickness: | 1oz~4oz | Board Thickness: | 0.5~ 3.2mm |
| Min. Hole Size: | 0.15mm | Min. Line Width: | 0.08mm | Min. Line Spacing: | 0.08mm |
| Surface Finishing: | HASL,Lead Free HASL, OSP,ENIG,Gold plating | Max. Panel Size: | 541*647mm(Special can do to 950mm) | Finish Hole Size: | PTH +/-0.003'' ,NPTH +/-0.002" |
| Hole Position Accuracy: | +/-0.003 | Aspect Ratio: | Min 1:8 | Flame resistance: | 94V-0 |
| High Vlotage endurance: | 1.3KV/mm | Hardness of resist ink: | ≥6H | Impedance control: | ±5% |
| PCB Item: | PCBA | Certificate: | ISO 9001:2000;ISO 14001; |
Specifications
electronic control board pcb assembly
a.PCB OEM&ODM
b.PCB Clone/Copy,Design
d.Turnkey service
e.UL,SGS,RoSH,TS
electronic control board pcb assembly
| No. | PCB Item | PCB Specification |
| 1 | Layers | 1 to 24 layers |
| 2 | Max working panel area | 457 x 610 mm |
| 3 | Min board thickness | 4 layer: 0.40mm |
| 6 layer: 0.80mm | ||
| 8 layer: 1.00mm | ||
| 10 layer: 1.20mm | ||
| 4 | Min trace width | 0.10mm |
| 5 | Min spacing | 0.10mm |
| 6 | Min hole diameter | 0.20mm |
| 7 | Min Copper thickness in hole | 0.020mm |
| 8 | PTH size tolerance | ±0.05mm |
| 9 | NPTH size tolerance | ±0.025mm |
| 10 | Hole position tolerance | ±0.05mm |
| 11 | Dimension tolerance | ±0.1mm |
| 12 | Min solder mask dam | 0.08mm |
| 13 | Insulation resistance | 1E+12Ω (normal condition) |
| 14 | Max Board thickness/Hole size Rate | 10:01 |
| 15 | Thermal shock endurance | 288 3 times in 10sec |
| 16 | Max Board twist and wrap | ≤0.7% |
| 17 | High Vlotage endurance | 1.3KV/mm |
| 18 | Copper foil peel off endurance | 1.4N/mm |
| 19 | Hardness of resist ink | ≥6H |
| 20 | Flame resistance | 94V-0 |
| 21 | Impedance control | ±5% |
| 22 | PCB Certificate | ISO 9001:2000;ISO 14001; ISO/TS16949:2002 ,UL E203640 |
FR1 , CEM3 , Ceramic main control board pcb assembly 1oz ~ 4oz ENIG Finish
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