Customized TG175 FR4 Flex PCB 0.5OZ base copper 8 layer Printed Circuit Board Assembly

Item

Customized FR4 PCB Assembly / Flex PCB

panel Max. size

18*28Inch or 10*29Inch

Min. trace width& space

inner-layer: 3.5/3.5Mil0.5OZ base copper

4/4Mil1OZ base copper

outer-layer:3.5/3.5Mil0.5OZ4/4Mil1OZ

Multi-layer FPC Max Layer

8-layer

Rigid-flex FPC Max Layer

16flex layer including max 6layer)

Material we normal use

Polyimide - Polyester

Flex thickness

25, 50, 75, 125µ

copper plating thickness

0.5 Oz, 1 Oz, 2 Oz

Insulation layer

25, 50, 75µ

Stiffener Material

FR4 , Polyimide

Rigid Material

FR4 , Polyimide

Min. Hole size

Laser drilling :0.1mm

CNC: 0.15mm

thickness tolerance for board thickness

0.3mm below:0.05mm

0.3-1.0mm:0.1mm

1.0 above:10%

Sn-Pb plating

2-40um

Tin plating

2-40um

Chemical Tin

0.8-1.2um

Ni-Au plating

Ni3-8um, Au0.025-0.13um

outline dimension tolerance

0.15mm

min hole diameter tolerance

0.05/0.075mm

min conductor width tolerance

10%

Stiffener Assembly Accuracy

0.05mm

adhesive laminate accuracy

+/-3UM

routing accuracy

0.15

finger to outline spacing tolerance

0.05mm

finger thinckness tolerance

0.1

pattern to outline edge space

10mIL

conductor width tolerance

20%

Outline dimension tolerance

0.15mm

Stiffener hole diameter tolerance

0.10mm

Distance between Coverlay and track

4Mil

silk screen printing Assuracy

6mIL

silk screen thickness

20-25UM

silver paste printing tolerance

15Mil

silk screen prirnting tolerance

6mil

silk screen Min. line width

4.5Mil

smallest pad diameter

16mIL

smallest hole diameter

0.2mm

largest hole diameter

6.4mm