China Categories
English
Home /Measuring & Analysing Instrument Stocks /

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

Brand Name:Bicheng Technologies Limited
Certification:UL
Model Number:BIC-0158-N0.158
Minimum Order Quantity:1
Delivery Time:10 working days
Payment Terms:T/T/Paypal
Contact Now

Add to Cart

Site Member
Location: Hong kong Guangdong China
Address: 803 Chevalier House, 45-51 Chatham Road South, Tsim Sha Tsui, Kowloon, Hong Kong
Supplier`s last login times: within 38 hours
Shipping
lt's easy to get a shipping quote! Just click the button below and complete the short form.
Get Shipping Quote
Product Details Company Profile
Product Details

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

This type of high frequency PCB is built on 50mil TMM6 substrate of which dielectric constant(DK) is 6.0 in process.

It is a double layer circuit board with 1oz copper and immersion gold on pad. Via holes with 0.3mm size are filled by

resin and capped by copper. Boards are covered with green solder mask and manufactured as per IPC class II standard.

Every 25 boards are vacuum-packed for shipment.


PCB Specifications

PCB SIZE117 x 88mm=1up
BOARD TYPEDouble sided PCB
Number of Layers2 layers
Surface Mount ComponentsYES
Through Hole ComponentsNO
LAYER STACKUPcopper ------- 17um(0.5 oz)+plate TOP layer
TMM6 1.270mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:4 mil / 4 mil
Minimum / Maximum Holes:0.30 mm / 2.0 mm
Number of Different Holes:5
Number of Drill Holes:2500
Number of Milled Slots:2
Number of Internal Cutouts:no
Impedance Control:no
Number of Gold finger:0
BOARD MATERIAL
Glass Epoxy:TMM6 1.270mm
Final foil external:1.0 oz
Final foil internal:N/A
Final height of PCB:1.4mm ±0.1
PLATING AND COATING
Surface FinishImmersion gold, 59%
Solder Mask Apply To:Top Layer and Bottom Layer
Solder Mask Color:Green
Solder Mask Type:LPI
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendComponent Side
Colour of Component LegendWhite
Manufacturer Name or Logo:Kuangshun
VIAPlated through hole(PTH), minimum size 0.30mm.
FLAMIBILITY RATING94V-0
DIMENSION TOLERANCE
Outline dimension:0.0059"
Board plating:0.0029"
Drill tolerance:0.002"
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.


Typical Applications:

1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems


Our PCB Capability(TMM6)


PCB Material:Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:TMM6
Dielectric constant:6
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..

Data Sheet of TMM6


PropertyTMM6DirectionUnitsConditionTest Method
Dielectric Constant,εProcess6.0±0.08Z10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign6.3--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.0023Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant-11-ppm/°K-55-125IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity2 x 10^8-Mohm.cm-ASTM D257
Surface Resistivity1 x 10^9-Mohm-ASTM D257
Electrical Strength(dielectric strength)362ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425TGA-ASTM D3850
Coefficient of Thermal Expansion - x18Xppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y18Yppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z26Zppm/K0 to 140 ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity0.72ZW/m/K80 ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)15.02X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)1.75X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.06-%D/24/23ASTM D570
3.18mm (0.125")0.2
Specific Gravity2.37--AASTM D792
Specific Heat Capacity0.78-J/g/KACalculated
Lead-Free Process CompatibleYES----

China TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold supplier

TMM6 Microwave Printed Circuit Board 50mil 1.27mm Rogers High Frequency PCB DK 6.0 With Immersion Gold

Inquiry Cart 0