Multiple Bare Dies Capacity Chip Holders For Dust-Free Die Storage And Safety

Multiple Bare Dies Capacity Chip Holders For Dust-Free Die Storage And Safety

The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack offers a safe and convenient solution for packaging and transporting various microelectronic components such as Chips, Dies, COGs, and Optoelectronic devices. These products come in different sizes and materials to meet diverse needs. The product specifications include options for 2-inch and 4-inch sizes, while materials range from Antistatic and Conductive ABS to PC. Customization is also available to cater to the specific requirements of customers.

Features:

Molded of ESD-safe Materials: Our products are made of ESD-safe, non-sloughing, and carbon-powder-free clean polymers to ensure the safety of your electronics equipment.

Carbon-Fiber Reinforced Design: To provide both strength and permanent ESD protection, our products are carbon-fiber reinforced, giving you added durability and peace of mind.

High Temperature Resistance: With an available bake temperature of up to 180°C, our products can withstand high-temperature environments, making them versatile for various applications.

Customized Industry-Standard Formats: Our products come in industry-standard formats that can also be customized to meet your specific needs, ensuring a tailored solution for your requirements.

Technical Parameters:

Specifications:

The external dimensions of waffle pack chip trays are standardized into different sizes: 2-inch, 4-inch, and so on, where each size corresponds to a square shape. The variability lies in the size of the pockets, their geometry, and the number of pockets present in the tray.

When it comes to waffle pack trays, they are typically described by several key characteristics:

• External size – 2”, 4”, etc.
• Pocket size or pocket count – selecting one will impact the other
• Temperature rating – specifies the maximum temperature at which the tray can be used

For custom waffle pack trays, additional specifications are necessary:

• Component geometry
• Special process requirements
• Quantity of trays needed or quantity of components to be processed (this helps determine the appropriate manufacturing process for tray production)