Ultra Fine Gold Bonding Wire with 0.0125mm and 0.05mm Diameter for Scientific Research

Gold wire has excellent electrical properties and low reactivity, making it ideal for applications that require stability, precision, and durability in harsh environments. Gold wire has a long history of use in the medical, aerospace, and electrical industries and can be purchased in the form of round or gold ribbon. Either form of gold wire can be made pure or mixed with beryllium which is used to prevent overheating in semiconductor applications.

Medical Applications Of Gold Wire

Gold wire is suitable for the following medical equipment and procedures:

• Electrosurgery
• Guide wire
• Stents
• Life-support devices
• Medical markers for X-rays
• CV therapies
• In vitro diagnostic devices

Gold wire provides radiopacity, or the ability to block X-rays, making it a popular material for medical markers in X-ray imaging and procedures that require high visibility such as stent and catheter placement.

Aerospace Applications Of Gold Wire

In the aerospace industry, sensors play a key part in temperature regulation and monitoring systems. Beyond temperature regulation, gold wire is also used in aerospace applications such as:

• Wire-wound potentiometers
• Aerospace instrumentation (avionics)
• Radio communication equipment

As a reliable conductor and connector, gold wire enables these critical pieces of equipment to function well in the harsh, high-pressure environments.

Electrical Applications Of Gold Wire

Gold wire is popular in electrical applications and can be found in a wide range of electronic devices such as:

• Imaging devices
• Televisions
• Smartphones
• Computers
• LEDs
• Orthodontic appliances

Gold’s conductivity enables a smooth, uninterrupted flow of electricity when incorporated into connectors or relay contacts. Within computers, gold wire is used inside the motherboard to attach cables and mount microprocessors allowing for rapid and reliable transmission through multiple components. Gold wire is also used for wire bonding, a process which connects an integrated circuit to its packaging, as it can withstand high pressure, heat, and ultrasonic energy.