TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

Brand Name:Ziitek
Certification:RoHS
Model Number:TIF100-18-01US
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Address: Plot CN4, Ming Lang Industrial Cluster, Vu Thu district, Thai Binh Province, Vietnam
Supplier`s last login times: within 1 hours
Product Details Company Profile
Product Details

TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

Product descriptions


TlF100-18-01US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features

> Good thermal conductivity: 1.8 W/mK

> Naturally tacky needing no further adhesive coating
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


Application

> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power SupplyCharging Pile
> LED Tvi Lighting
> Graphics Card Thermal Module

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF100-18-01US Series
PropertyValueTest method
ColorBlack*****
Construction &CompostionCeramic filled silicone elastomer*****
Specific Gravity2.5g/ccASTM D297
Outgassing(TML)0.45%ASTM C351
Hardness18 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃*****
Dielectric Breakdown Voltage>5500 VACASTM D149
Dielectric Constant4.5MHzASTM D150
Volume Resistivity1.0X1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Thermal conductivity1.8W/m-KASTM D5470

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)


Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company Profile


With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

China TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module supplier

TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

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