Oukai OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer Dry Wet Vacuum 510×340mm PCB SMT Equipment

OK-SP460-C Auto Stencil Cleaning Fully Automatic Solder Paste Printer

The OK-SP460-C is equipped with an integrated three-mode automatic stencil cleaning system (dry, wet, and vacuum) that maintains stencil aperture integrity through extended production runs. By eliminating manual stencil wiping, it reduces downtime, improves print consistency, and extends stencil service life.

Key Features

• Three-Mode Cleaning: Dry wipe removes residual paste, wet cleaning dissolves hardened deposits, and vacuum extraction removes debris automatically
• Programmable Frequency: Set cleaning intervals from every 1 to 99 prints based on paste type and production requirements
• 400mm Paper Roll: Large-capacity cleaning paper roll supports full-shift unmanned operation
• Bottom-Side Cleaning: Dedicated underside cleaning mechanism prevents paste buildup that causes bridging defects
• Solvent Management: Precision solvent dispensing with low-level sensor alarm prevents dry-wipe cleaning damage to stencils
• CCD Vision Alignment: Accurate registration maintained throughout cleaning cycles with automatic recalibration

Technical Specifications

Applications

Ideal for 24/7 high-volume SMT lines running fine-pitch paste (Type 4/5) where stencil clogging can cause intermittent printing defects. Recommended for automotive electronics, smartphone assembly, and any process where first-pass yield above 99.5 percent is required.

Packaging and Shipping

Standard export wooden crate packaging with dedicated compartment for cleaning consumables including initial roll. Shipping in 7-15 working days.