Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

Brand Name:Ziitek
Certification:UL & RoHS
Model Number:TIF100-65-11ES
Minimum Order Quantity:1000pcs
Delivery Time:3-5 work days
Payment Terms:T/T
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Verified Supplier
Location: Dongguan Guangdong China
Address: No.12 Xiju Road,, Hengli Township, Dongguan City, 523460 Guangdong Province, China
Supplier`s last login times: within 2 hours
Product Details Company Profile
Product Details

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs


Products Discription

TIF®100-65-11ES Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of theheat-generating electroniccomponents.


Features


>Excellent thermal conductivity: 6.5 W/mK
>Naturally tacky needing no further adhesive coating
>High compliance adapts to various pressure application environments
>Available in different thickness options


Applications


>Heat dissipation structure for radiators
>Telecommunication equipment
>Automotive electronics
>Battery packs for electric vehicles
>LED TV and lamps


Typical Properties of TIF®100-65-11ES Series
PropertyValueTest method
ColorGrayVisual
Construction &CompostionCeramic filled silicone elastomer***
Thickness range0.02~0.20inch(0.50~5.0mm)ASTM D374
Hardness12 Shore 00ASTM 2240
Density3.4 g/ccASTM D792
Recommended Operating Temp-40 ~ 200℃Ziitek Test Method
Breakdown Voltage(V/mm)>5500ASTM D149
Dielectric Constant @1MHz7.0 MHzASTM D150
Volume Resistivity≥1.0X1012Ohm-cmASTM D257
Fire rating94 V0UL E331100
Thermal conductivity6.5W/m-KASTM D5470

Product Specifications


Standard Thickness: 0.02" (0.50 mm)-0.20" (5.00 mm) with increments of 0.01" (0.25 mm).
Standard Size: 16" X16" (406 mmX 406 mm).
Component Codes:
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company profile


Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


Independent R&D team


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China Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs supplier

Premium Soft Heat Sink Silicone Thermal Pad Low Thermal Resistance Thermal Gap Filler For Advanced Cooling Needs

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