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Multilayer PCB with High Frequency Layout Design Blind Buried vias pcb

Multilayer PCB with High Frequency Layout Design Blind Buried vias pcb

Brand Name:found
Certification:ISO UL
Model Number:fd21
Minimum Order Quantity:1
Payment Terms:T/T
Place of Origin:China
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Location: Shenzhen Guangdong China
Address: NO.1 Industry Park, XinSheng Village, Longgang District, ShenZhen
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Multilayer PCB with High Frequency Layout Design Blind Buried vias pcb

  • Product Description 1.1 General description This is a type of high frequency PCB built on 10mil RO4350B substrate with Tg 280°C for the application of portable antenna. It's 0.3 mm thick with 2 layers copper, black silkscreen directly on substrate and immersion gold on pads. The base...
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  • Product Details

Product Description

1.1 General description
This is a type of high frequency PCB built on 10mil RO4350B substrate with Tg 280°C for the
application of portable antenna. It's 0.3 mm thick with 2 layers copper, black silkscreen directly
on substrate and immersion gold on pads. The base material is from Rogers Corp supplying
4 types PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data.
Each 50 panels are packed for shipment.

1.2 Features and benifits


a. RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it
an ideal substrate for broadband applications;
b. Excellent high frequency performance due to low dielectric tolerance and loss;
c. Tg > 280 C;
d. 16000 square meter workshop;
e. 30000 square meter month capability;
f. RoHS materials;
g. Eligible products rate of first production: >95%
h. No quality complaint is meant to save money;
i. No MOQ, low cost for prototypes and small runs quantity.

1.3 Application
LNA, Photocoupler, RFID, Trunk amplifier

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China Multilayer PCB with High Frequency Layout Design Blind Buried vias pcb supplier

Multilayer PCB with High Frequency Layout Design Blind Buried vias pcb

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