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FR4 Material HASL/ENIG Surface treatment 2oz 3layers BGA Assembly SMT Printed Circuit Board Assembly

FR4 Material HASL/ENIG Surface treatment 2oz 3layers BGA Assembly SMT Printed Circuit Board Assembly

Brand Name:OEM
Certification:UL/ROHS/ ISO9001
Model Number:KAZA-010
Minimum Order Quantity:1 Unit
Delivery Time:10 ~ 20 Work days
Payment Terms:Western Union, T/T, L/C, D/P, MoneyGram
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Room 502, 26# Building, Funing Hi-Tech Industrial Park, Fuhai Street, Bao'an, Shenzhen, Guangdong, China, 518103
Supplier`s last login times: within 1 hours
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Product Details

FR4 Material BGA Assembly SMT Printed Circuit Board Assembly


1. Features


1. One Stop OEM Service, Made in Shenzhen of China

2. Manufactured by Gerber File and BOM List from Customer

3. FR4 Material, Meet 94V0 standard

4. SMT, DIP technology suport

5. Lead Free HASL, Environmental Protection

6. UL, CE, ROHS Compliant

7. Shipping By DHL,UPS, TNT, EMS or Customer requirement


2. PCBA Technical capability


SMTPosition accuracy:20 um
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
Max. component height::25mm
Max. PCB size:680×500mm
Min. PCB size:no limited
PCB thickness:0.3 to 6mm
PCB weight:3KG
Wave-SolderMax. PCB width:450mm
Min. PCB width: no limited
Component height:Top 120mm/Bot 15mm
Sweat-SolderMetal type :part, whole, inlay, sidestep
Metal material:Copper , Aluminum
Surface Finish:plating Au, plating sliver , plating Sn
Air bladder rate:less than20%
Press-fitPress range:0-50KN
Max. PCB size:800X600mm
TestingICT,Probe flying,burn-in,function test,temperature cycling

2. PCBA Pictures




China FR4 Material HASL/ENIG Surface treatment 2oz 3layers BGA Assembly SMT Printed Circuit Board Assembly supplier

FR4 Material HASL/ENIG Surface treatment 2oz 3layers BGA Assembly SMT Printed Circuit Board Assembly

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