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New tech semi-auto laser position iphone 6 motherboard reballing machines

New tech semi-auto laser position iphone 6 motherboard reballing machines

Brand Name: WDS
Certification: CE,ISO
Model Number: WDS-550
Minimum Order Quantity: 1 PCS
Delivery Time: 2 days after full payment
Payment Terms: T/T,Paypal,MoneyGram,Western Union,escrow
Shenzhen Wisdomshow Technology Co., Ltd.
Active Member
Shenzhen Guangdong
Business type: Manufacturer, TradingCompany
Telephone : 86-0755-27336219
No.6 Haosi Western Industrial Park , Shajing Town,Bao'an District, Shenzhen, China
Supplier`s last login times: within 10 hours

New tech semi-auto laser position iphone 6 motherboard reballing machines WDS-550

Do you want to improve the work efficiency?


Many BGA rework station models are provided here!
Please contact us,

So we can help you select the right machine to meet your needs and fit your budget !


Business field


  • Laptop and mother boards rework and repair.
  • Game consoles applications rework and repair.
  • Small and medium size electronics assembly factories.
  • Military sophisticated applications rework and repair.
  • Medical equipment applications rework and repair.
  • Automotive applications rework and repair.
  • Light systems and LED applications.
  • Home appliance and personal Gadgets applications rework and repair.
  • Networking and communication applications rework, repair and assembly.
  • Power supply and control PCB applications rework, repair and assembly.

iphone 6 motherboard reballing machines


Company Information
Manufacturer:Shenzhen Wisdomshow Technology Co., Ltd
Brand:WDS/wisdomshow
Address: No.6 Haosi Western Industrial Park ,Shajing Town,Bao'an District,Shenzhen,China
Main Product:BGA rework station,many models are available
Website:www.wdsbga.com

Contact way:Skype: salesool-wisdomshow

What's app: +86 15573072473

iphone repair .jpg


Why WDS?

1. We are the Manufactuer = own factory+ machine design+Sheet metal produced by ourself +spray the powder+ strong assemble the machine team + packaging+free training;

2. Logo/Brand:Customer's designs and logos are welcome,we can silk-print your own logo company;

3. HUAWEI,TCL,ZTE,MEIZU,KONKA,LENOVO,FOXCONN vendor;

4. Have good market in Korea,Japan,NorthAfrica,Vietnam,Brazil,Turkey,India,Mexico and South Asia,The Mid-East and European countries;

5. 100% NEW from WDS factory;

6. Over 20 R&D engineers, with 10 year experience;

7. Over 100000 Global User;

8. All models approved CE ISO9001;

9. 100% QC inspect before shipment;

10. High quality & competitive price.


bga reballing machine bga repair machine

Product Description

WDS-550 bga repair machine


Where BGA rework station can be used?

1. Smart phone /iPhone/iPad repair;

2. Notebook/ Laptop /Computer/Macbook /PC repair;

3. XBOX 360/PS2/ PS3/PS4 Wii and so on video game consoles repair;

4. Othe LED/SMD/SMT/IC BGA rework;

5. BGA VGA CPU GPU soldering desoldering;

6.BGA chips,QFP QFN chip,PC,PLCC PSP PSY rework.

iphone 6 motherboard reballing machines WDS-550 parameter


1

Total Power

4800W

2

Upper Heating Power

800W

3

Lower Heating Power

Second zone:1200W, Third zone: IR 2700W(1200w controlled)

4

Power Supply

(Single Phase) AC 220V±10% 50/60HZ

5

Overall Dimension

L500*W630*H600mm

6

Locating Mode

V-shape card slot+universal fixture+laser position,locate fast

7

Temperature Controlling

K-type thermocouple closed loop control, independent temperature control, precision up to ±2℃

8

Electrical Material

High sensitive temperature control module+ Delta PLC,+Touch Screen made-in Taiwan+Step driver

9

PCB Size

Max 400*370mm, Min 10*10mm

10

Thermocouple Ports

1 unit

11

PCB thickness

1-5mm

12

Applicable chip

1*1mm-70*70mm

13

Weight of machine

40KG

iphone 6 motherboard reballing machines WDS-550 specifications:

1.Adopts mechatronics design,Z axis adopts step driver,the upper heater can move up and down automatically;the upper heater and placement head are designed 2 in 1,can pick up BGA automatically;with laser position,can locate the chips place fast,easy to use.


2.Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.


3.Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±2℃.the up heating head can remove the BGA chips automatically;the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.


4.The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.


5.High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.


6


Product Tags:

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New tech semi-auto laser position iphone 6 motherboard reballing machines