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Usb Flash Pcb Board

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usb flash pcb board

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Industrial Conductive Plastic Bags 9.5"X14" #4 Corrosion Resistant This kind of bag can keep products away from damages due to static, Its s... Dongguan Magic Packing Technology CO.,LTD​  
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Dongguan (China)
Key Specifications/Special Features: Material: FR4 Layer count: 4 CTI: >600V Board thickness: 1.6mm Surface technique: HAL lead-free and red solder... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
AddThis Sharing ButtonsShare to FacebookShare to TwitterShare to Google+Share to PinterestShare to LinkedInShare to ... OEM USB PCBChuante Electronic... Quzhou Chuante Electronic Technology Co.,Ltd  
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... Ofweek Co.,Ltd  
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Shenzhen (China)
Core Module Board is designed by 6-floor PCB; the volume is only card size; together with CPU, SDRAM, NandFlash, DataFLash, network; using 3.3V dc pow... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
... OPEN Electrical Technology Co., Ltd .  
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Wenzhou (China)
... Zhejiang Province Wei Leite Electric Co., Ltd.  
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Quzhou (China)
... "TianHao Technologes and TianHao Dispensing  
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Ningbo (China)
Key Specifications/Special Features: Material: FR4 Layer count: 4 Board thickness: 1.6mm Surface technique: red solder mask Minimum hole size: 0.4mm R... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
Key Specifications/Special Features: Material: FR4 Layer count: 6 Board thickness: 1.6mm Surface technique: hal lead free Minimum hole size: 0.4mm Bli... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
Key Specifications/Special Features: Material: FR4 Layers: 4 Board thickness: 1.6mm Blind holes High TG Red solder mask Minimum hole size: 0.4mm Appli... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
Key Specifications/Special Features: Material: FR4 4-layer memory PCB Layer count: 4 Board thickness: 1.6mm Surface technique: red solder mask Minimum... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
Key Specifications/Special Features: Material: FR4 Layer count: 4 Board thickness: 1.6mm Surface technique: red solder mask Minimum hole size: 0.4mm A... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
Key Specifications/Special Features: Layer count: 4 Material: FR4 Board thickness: 1.6mm Surface technique: red solder mask Minimum hole size: 0.4mm A... Zhejiang Zapon Electronic Technology Co. Ltd  
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Wenzhou (China)
... Ofweek Co.,Ltd  
ICP Remarked Supplier
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Shenzhen (China)
Core Module is designed by 6-floor PCB; the volume is only card size; together with CPU, DDR2 RAM, NandFlash, DataFLash, network; using 5V dc power su... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
ATMEL AT91SAM9260 CPU, ARM926EJ-S Core; With 8KB instructions, data buffer, 200MHz, 210MIPS operation performance; 3.3V NAND FLASH, batch use, c... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
QY-9263S Mainboard is designed by 8-floor PCB; On-board CPU, SDRAM, NandFlash, DataFLash; with commonly used interfaces, such as TFT-LCD, touch screen... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
Core Module is designed by 6-floor PCB; On-board 64M SDRAM, 32MB NorFlash; with commonly used interfaces, such as TFT-LCD, touch screen, VGA, network,... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
ATMEL AT91SAM9263 CPU, 200MHz ARM926EJ-S core, 220MIPS operation performance; Have 2D graphics coprocessor; Support large capacity NandFlash, ha... Hangzhou Qiyang Intelligent Technology Company  
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Hangzhou (China)
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