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Mocu Heat Sink Through Nickel And Gold Plating

Mocu Heat Sink Through Nickel And Gold Plating

Brand Name:JBNR
Certification:ISO9001
Model Number:HCMC017
Minimum Order Quantity:10 pcs
Delivery Time:20 days
Payment Terms:L/C, D/A, D/P, T/T, Western Union
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Location: Zhuzhou Hunan China
Address: No.5 Building, No.581 Heilong Jiang Road, Li Yu Industrial Park, Tian Yuan District, Zhuzhou, Hunan, P.R. China.
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Product Details

Excellent Hermeticity Through Nickel And Gold Plating Mocu Heat Sink For Rf Amplifiers


Description:

With technology development, there are more need for higher power in smaller microelectronics components. This also increase the requirements for heat dissipation.

For sensitive components, to use metal composite like molybdenum copper material is a wise choice.


Case study:

For radar systems, our customers need custom-shaped electronics heat sink for its channels.

The dimensions of the part is about 0.2mm thickness, 4.5mm width, and 6.8mm length.

To reach a good thermal conductivity, we offer 70Mo30Cu for its application.

The molybdenum copper heat sink is nickel plated based on the specification in SAE AMS-C26074 and gold plated based on the

specification Mil-G-45204C.


Product Properties:

GradeMo ContentDensity g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
70MoCu70±2%9.87200(25℃)/196(100℃)
60MoCu60±2%9.667.5222(25℃)/217(100℃)
50MoCu50±2%9.510.2250(25℃)/220(100℃)

Application:

Molybdenum copper have been used in various fields like opto-electronics, high-frequency applications, power electronics and micro-electronics.

In these sectors, they are often employed in below components like:


GaN/GaAs transistors

Ceramic packages used in microwave and RF fields

Components in radio base station of telecommunication

High-power LEDs

IGBT modules for EV/HEV and stationary transformers

Product Tags:
China Mocu Heat Sink Through Nickel And Gold Plating supplier

Mocu Heat Sink Through Nickel And Gold Plating

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