Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB

Half Hole High Tg HDI 4G Module Communication Multilayer Circuit Board PCB

Shenzhen Fanyi Technology Co.,Ltd established in 2013, based on Silicon Valley technology in the United States, dedicated to high cost- effective PCB product production.Shenzhen Fanyi focus on R&D and production of high-end multi-layer printed circuit boards (2 - 60 layers) and HDI boards (1+H+1, 2+H+1, blind buried holes); our factory covers an area of 50,000 square meters and has a production capacity of 80,000 square meters PCB boards per month.

The factory has set up a team of Taiwanese executives and introduced professional imported equipment. We have strict QA system: carefully selected high-quality raw materials such as Shengyi(SYE)/kingBoard (KB) A-grade copper clad laminates and Taiyo solder mask inks. Our factory fully implements ISO9001:2015, ISO14001:2015, IATF16949:2016, UL, RoHS, REACH management system, strict implementation of IPCII standard, independent research and development of intelligent panel array system and real-time online tracking system for manufacture progress, all-round guarantee the "high quality, short delivery" service commitment.

Shenzhen Fanyi is the preferred supplier for communication equipment manufacturers, automobile manufacturers and medical enterprises, such as: HuaWei, ZTE, Datang Telecom, Xinwei Communication, Weichai, China South Locomotive, BYD, and Huada Gene. The products are widely applied by 20,0000+ worldwide enterprises on communications, medical, industrial control, security, automotive, electric power, aviation, military, computer peripherals and other fields.