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OEM Multilayer PCB Board High Output Fast Prototyping For LED Driver Products

OEM Multilayer PCB Board High Output Fast Prototyping For LED Driver Products

Brand Name:China chao sheng
Certification:ISO/UL/RoHS/TS
Model Number:three layers of iron-based pit PCB
Minimum Order Quantity:1PCS
Delivery Time:15-18day
Payment Terms:T/T, Western Union
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Location: Hong kong Hong kong China
Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
Supplier`s last login times: within 48 hours
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Product Details

three layers of iron-based pit PCB LED driver products iron base pit PCB+FR-4+PPTG180, cop per thickness rigid flex pcb


Product Description

  1. Product area: LED driver products
  2. Number of layers: three layers of iron-based pit PCB
  3. Plate thickness: 2.0mm
  4. Product structure: iron base pit PCB+FR-4+PPTG180, copper thickness
  5. 5OZ, sinking hole, electric nickel gold 5U"
  6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB
  7. standard.
  8. Quantities range from prototype to volume production.
  9. 8. 100% E-Test
  10. Packaging: Vacuum Packaging + Moisture-proof Bead + Humidity Card + Carton
  11. Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PCB, FPC main material supplier

NOsupplierSupply material nameMaterial origin
1JapanHigh frequency materials, PI, covering membrane,Copper berthMitsubishi Japan
2dupontHigh frequency materials, PI, covering film, dry film,Copper berthJapan
3panasonicHigh frequency materials, PI, covering membrane,Copper berthJapan
4SanTiePI, covering membraneJapan
5Born goodFR-4,PI,PP,Copper berthshenzhen, China
6A rainbowPI, covering membrane,Copper berthTaiwan
7teflonHigh frequency materialsThe United States
8RogersHigh frequency materialsThe United States
9Nippon SteelPI, covering membrane,Copper berthTaiwan
10sanyoPI, covering membrane,Copper berthJapan
11South AsiaFR-4,PI,PP,Copper berthTaiwan
12doosanFR-4,PPSouth Korea
13Tai Yao plateFR-4,PP,Copper berthTaiwan
14AlightFR-4,PP,Copper berthTaiwan
15YaoguangFR-4,PP,Copper berthTaiwan
16YalongFR-4,PPThe United States
17ISOALFR-4,PPJapan
18OAKBuried, buried resistance, PPJapan
19United States 3MFR-4,PPThe United States
20BergsCopper and aluminum matrixJapan
21The suninkTaiwan
22MuratainkJapan
23generous andbenevolentPI, covering membrane,Copper berthChina's jiangxi
24YasenPPI, covering membraneChina jiangsu
25Yong Sheng TaiinkChina guangdong panyu
26mitainkJapan
27Transcriptceramic materialTaiwan
28HOMEceramic materialJapan
29Fe-Ni-MnAlloy Invar, Section SteelTaiwan

PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products16:


FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

China OEM Multilayer PCB Board High Output Fast Prototyping For LED Driver Products supplier

OEM Multilayer PCB Board High Output Fast Prototyping For LED Driver Products

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