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Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

Brand Name:China chao sheng
Certification:ISO/UL/RoHS/TS
Model Number:18-layer PCB production, purchasing components
Minimum Order Quantity:1PCS
Delivery Time:PCB 20 days / PCBA three days
Payment Terms:T/T, Western Union
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Location: Hong kong Hong kong China
Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
Supplier`s last login times: within 48 hours
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Product Details Company Profile
Product Details

18-layer HDI3 order PCB production component purchasing SMT DIP,pcb production ,wooden box, pcb service processing carton packaging,wooden box,SMT PCB Service

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.


Product Description

  1. 18-layer HDI3 order PCB production component purchasing SMT DIP processing ,carton packaging,wooden box,SMT PCB Service
  2. 18-layer automotive product PCBA
  3. 18-layer HDI3 order PCB production component purchasing SMT DIP processing
  4. Detailed Product Description
  5. PCBA processing method
  6. PCB production + it contains SMT, DIP, TEST,
  7. Helpset, assembled OEM factory
  8. 2: Electronic materials supply or our purchasing method

PCBA multiple packaging methods:

  1. Inner box for electrostatic film simple packaging + wooden box or carton packaging
  2. inner box plastic box + wooden box or carton packaging
  3. vacuum packaging + wooden box or carton packaging
  4. Packing is done according to your requirements
  5. Packing: vacuum packaging / tin wrapped paper + humidity card + moisture-proof + carton packaging
  6. PCB, FPC process production capability

Specifications

- Contract Manufacturing

- Engineering Services

- PCB Design & Assembly

- Product Design

- Prototyping

- Cable and Wire Assemblies

- Plastics and Molds


PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test


PCBA capabilities:
Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly

Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection

PCB board components, including all types of BGAs, QFNs, CSPs, 0201, 01005, POP, and Pressfit Components in small quantities

Part Polarity Capacitors, SMT Polarized Capacitors, and Through-Hole Polarized Capacitors

ROHS capability


IPC-A-610E and IPC/EIA-STD workmanship operation

PCB,FPCProcess capability table

Technical ltem

MassProduct

Advanced Technology

2016

2017

2018

Max.Layer Count

26L

36L

80L

Through-hole plate

2~45L

2~60L

2~80L

Max.PCBSize(in)

24*52"

25*62"

25*78.75"

The layer number of FPC

1~36L

1~50L

1~60L

Max.PCBSize(in)

9.8"*196"

9.8"*196"

10"*196"Reel to reel

Layeredplatelayer

2~12L

2~18L

2~26L

Max.PCBSize(in)

9"*48"

9"*52"

9"*62"

Combination of hard and soft layers

3~26L

3~30L

3~50L

Interconnect HDI

5+X+5Interconnect HDI

7+X+7Interconnect HDI

8+X+8,Interconnect HDI

HDI PCB

4~45L

4~60L

4~80L

Interconnect HDI

3+20+3

4+X+4Interconnect HDI

4+X+4,Interconnect HDI

Max.PCBSize(in)

24"*43"

24"*49"

25"*52"

Material

FR-4 Rogers

FR-4 Rogers

FR-4 Rogers

Base material

Halogenfree,LowDK

Halogenfree,LowDK

Halogenfree,LowDK

Build-up Material

FR-4

FR-4

FR-4

BOard,Thickness(mm)

Min.12L(mm)

0.43

0.42~8.0mm

0.38~10.0mm

Min.16L(mm)

0.53

1.60~8.0mm

0.45~10.0mm

Min.18L(mm)

0.63

2.0~8.0

0.51~10.0mm

Min.52L(mm)

0.8

2.50~8.0mm

0.65~10.0mm

MAX(mm)

3.5

10.0mm

10.0mm

Min.CoreThickness um(mil)

254"(10.0)

254"(10.0)

0.10~254(10.0mm)

Min.Build up Dielectric

38(1.5)

32(1.3)

25(1.0)

BaseCopperWeight

Inner Layer

4/1-8 OZ

4/1-15 OZ

4/1-0.30mm

Out Layer

4/1-10 OZ

4/1-15 OZ

4/1-30 OZ

Gold thick

1~40u"

1~60u"

1~120u"

Nithick

76~127u"

76~200u"

1~250u"

Min.HOle/Land um(mil)

150/300(6/12)

100/200(4/8)

100/200(4/8)

Min.Laser via/landum(mil)

60/170(2.4/6.8)

50/150(2/6)

50/150(2/6)

Min. IVH,Hole size/landum(mil)

150/300(6/12)

100/200(4/8)

100/200(4/8)

DieletricThickness

38(1.5)

32(1.3)

32(1.3)

125(5)

125(5)

125(5)

SKipvia

Yes

Yes

Yes

viaoNhie(laserviaon BuriedPTH)

Yes

Yes

Yes

Laser Hole Filling

Yes

Yes

Yes

Technicalltem

Mass Product

Advanced Technolgy

2017year

2018year

2019year

Drill hole depth ratio

ThroughHole

2017year

.40:1

.40:1

Aspet Ratio

Micro Via

.35:1

1.2:1

1.2:1

Copper Filling Dimple Size um(Mil)

10(0.4)

10(0.4)

10(0.4)

Min.LineWidth&space

lnner Layer um(mil)

45/45(1.8/1.8)

38/38(1.5/1.5)

38/38(1.5/1.5)

Plated Layer um(mil)

45/45(1.8/1.8)

38/38(1.5/1.5)

38/38(1.5/1.5)

BGAPitch mm(Mil)

0.3

0.3

0.3

Min.PTH Hole ring um(mil)

75(3mil)

62.5(2.5mil)

62.5(2.5mil)

Line Width Control

∠2.5MIL

±0.50

±0.50

±0.50

2.5Mil≤L/W∠4mil

±0.50

±0.50

±0.50

≦3mil

±0.60

±0.60

±0.60

Laminated structure

Layer by layer

3+N+3

4+N+4

5+N+5

Sequential Build-up

20L Any Layer

36L Any Layer

52L Any Layer

Multi-layer overlay

N+N

N+N

N+N

N+X+N

N+X+N

N+X+N

sequential Lamination

2+(N+X+N)+2

2+(N+X+N)+2

2+(N+X+N)+2

Soft and hard bonding

2+(N+X+N)+2

2+(N+X+N)+2

2+(N+X+N)+2

PTH filling process

PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

PTH resin plug hole + plating fill
Electroplated hole/copper plug hole


PCB, FPC main material supply

NO

supplier

Supply material name

Material origin

1

Japan

High frequency materials, PI, covering membrane,Copper berth

Mitsubishi Japan

2

dupont

High frequency materials, PI, covering film, dry film,Copper berth

Japan

3

panasonic

High frequency materials, PI, covering membrane,Copper berth

Japan

4

SanTie

PI, covering membrane

Japan

5

Born good

FR-4,PI,PP,Copper berth

shenzhen, China

6

A rainbow

PI, covering membrane,Copper berth

Taiwan

7

teflon

High frequency materials

The United States

8

Rogers

High frequency materials

The United States

9

Nippon Steel

PI, covering membrane,Copper berth

Taiwan

10

sanyo

PI, covering membrane,Copper berth

Japan

11

South Asia

FR-4,PI,PP,Copper berth

Taiwan

12

doosan

FR-4,PP

South Korea

13

Tai Yao plate

FR-4,PP,Copper berth

Taiwan

14

Alight

FR-4,PP,Copper berth

Taiwan

15

Yaoguang

FR-4,PP,Copper berth

Taiwan

16

Yalong

FR-4,PP

The United States

17

ISOAL

FR-4,PP

Japan

18

OAK

Buried, buried resistance, PP

Japan

19

United States 3M

FR-4,PP

The United States

20

Bergs

Copper and aluminum matrix

Japan

21

The sun

ink

Taiwan

22

Murata

ink

Japan

23

generous andbenevolent

PI, covering membrane,Copper berth

China's jiangxi

24

Yasen

PPI, covering membrane

China jiangsu

25

Yong Sheng Tai

ink

China guangdong panyu

26

mita

ink

Japan

27

Transcript

ceramic material

Taiwan

28

HOME

ceramic material

Japan

29

Fe-Ni-Mn

Alloy Invar, Section Steel

Taiwan


PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED and other electronic products


FAQ:
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: How can I know the process of my PCB production?
A: 5-15days for PCB production and components purchasing, and 14-18 days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB,PCBA products work well before shipping. We'll test all of them according to your test procedure.

China Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color supplier

Rigid Flex SMT PCB Service Immersion Gold Surface Finishing Custom Solder Mask Color

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