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Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

Brand Name:China chao sheng
Certification:ISO/UL/RoHS/TS
Model Number:Six layers of soft and hard PCBA
Minimum Order Quantity:1PCS
Delivery Time:20-25day
Payment Terms:T/T, Western Union
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Location: Hong kong Hong kong China
Address: Huishang Building, 19-128 Nathan Road, Yau Tsim Sha Tsui, Yau Tsim, Hong Kong
Supplier`s last login times: within 48 hours
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Product Details

Six layers of soft and hard combined production circuit test,wooden box carton packaging,SMT PCB Service,taconic pcb


Product Description

  1. Six layers of soft and hard combined production + SMT, PCBA wooden box carton packaging,SMT PCB Service,taconic pcb
  2. PCBA processing method
  3. PCB production + it contains SMT, DIP, TEST,
  4. RoHS Lead Free Control Board SMT PCB Assembly 1.6mm PCB Service

    Printed circuit board (pcb) and PCBA products
    Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
    Flexible circuit board (FPC) and FPCA product areas
    CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

Technical requirement:

  1. Professional surface-mounting and through-hole soldering technology
  2. Various sizes are available, like 1206, 0805, 0603 components SMT technology
  3. ICT (in circuit test), FCT (functional circuit test) technology
  4. PCB assembly with UL, CE, FCC and RoHS approvals
  5. Nitrogen gas reflow soldering technology for SMT
  6. High standard SMT and solder assembly line
  7. High density interconnected board placement technology capacity

Quote requirement:

  1. Gerber file of the bare PCB board
  2. BOM (bill of material) for assembly
  3. To short the lead time, please kindly advise us if there is any acceptable components substitution
  4. Testing guide and test fixtures if necessary
  5. Programming files and programming tool if necessary
  6. Schematic if necessary
  7. OEM/ODM/EMS services for PCBA:
  8. PCBA, PCB assembly: SMT, PTH and BGA
  9. PCBA and enclosure design
  10. Components sourcing and purchasing
  11. Quick prototyping
  12. Plastic injection molding
  13. Metal sheet stamping
  14. Final assembly
  15. Test: AOI, in-circuit test (ICT), functional test (FCT)
  16. Custom clearance for material importing and product exporting

Specifications

  1. Layer: 4 layer
  2. Material: FR4
  3. Board Thickness: 1.6mm
  4. Surface Treatment: Lead free HASL
  5. Solder Mask: Green
  6. Size: 123mm*36mm
  7. Copper Thickness: 1.5oZ
  8. Min. Hole Size: 0.15mm
  9. Min. Line Width: 0.08mm
  10. Min. Line Spacing: 0.08mm
  11. Hole vias: Buried hole and blind hole

Orientronic PCB assembly equipmet

  • Fully automatic SMT stencil printer: FolunGwin Win-5
    • SMT machine: Siemens SIPLACE D1/D2/Siemens SIPLACE S20/F4
    • Reflow oven: FolunGwin FL-RX860
    • Wave soldering machine: FolunGwin ADS300
    • Automated optical inspection (AOI): Aleader ALD-H-350B
  • Needed:
    • PCB gerber file
    • BOM list for PCB assembly
    • Send us your sample PCB board or PCBA
  • Advantages:
    • Turnkey manufacturing or quick-turn prototypes
    • Board-level assembly or complete system integration
    • Low-volume or mixed-technology assembly for PCBA
    • Even consignment production
    • Supported capabilities
  • Type of assembly:
    • THD (thru-hole device)/conventional
    • SMT (surface-mount technology)
    • SMT and THD mixed
    • Double-sided SMT and/or THD assembly
  • Components:
    • Passives, smallest size 0201
    • Fine pitch to 08 Mils
    • Leadless chip carriers/BGA, VFBGA, FPGA and DFN
    • Connectors and terminals
  • Component packaging:
    • Reels
    • Cut tape
    • Tube
    • Loose parts
  • Board dimensions:
    • Smallest size: 0.25 x 0.25 inch/6 x 6mm
    • Largest size: 15.75 x 13.5 inches/400 x 340mm
  • Board shape:
    • Rectangular
    • Round
    • Slots
    • Cutouts
    • Complex
    • Irregular
  • Board type:
    • Rigid
    • Flexible
    • Rigid-flexible
  • Solder type:
    • Leaded and lead-free
    • Water soluble solder paste
    • Manual soldering for special parts, such as wires and temperature sensitive parts
  • Design file format:
    • Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG
    • BOM (bill of materials)
    • Pick and place file (XYRS)

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

China Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard supplier

Camera Taconic SMT Prototype Assembly , SMT Electronic Assembly IPC-II Standard

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