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PCB Description | Our PCB Board Capability | ||
PCB Surface Finishes | electrolytic nickel-gold, HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver | ||
PCB Max. Size | 1200mm×600mm | ||
PCB Min. Size | 5mm×5 mm | ||
Bow & Twist Tolerance | Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5% | ||
Min. Board Thickness & Tolerance | 0.2mm±0.08mm | ||
PCB Min. trace/spacing | Tin board:0.2mm±20%(8mil±0%) | ||
gold board:0.075mm±20%(3mil±0%) | |||
Copper to Board Edge Spacing | 0.5mm(20mil) | ||
Hole to Trace Spacing | 0.3mm(12mil) | ||
Min. Hole Diameter | 0.2mm±.076mm(8mil±3mil) | ||
Min. Hole Clearance | 0.4mm±.076mm(16mil±3mil) | ||
Copper Thickness on Hole Wall | 20-25um(0.79mil-1.0mil) | ||
Hole Location Tolerance | ±0.076mm(l±3mil) | ||
Min Diameter of Punching Hole | FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil) | ||
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil) | |||
PCB Min. Punching Slot | FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil) | ||
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil) | |||
Trace width variation | ±0.076mm(±3mil) | ||
Outline Tolerance | Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil) | ||
V-CUT Registration Tolerance±0.2mm (±8mil) | |||
PCB BOARD Type | Single-sided, double-sided, multi-layer | ||
Major Material | FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base | ||
PCB BOARD Thickness | 0.2-3.5mm | ||
Base Copper Thickness | 11um 35um 70um 105um | ||
Max. aspect ratio(board thickness: hole size) | 8:1 | ||
V-Cut Angle Tolerance | ±5° | ||
V-Cut Board Thickness | 0.4mm -3.2mm(16mil -128mil) | ||
Min SMT Pitch | 0.3mm(12mil) | ||
Min. Component mark | 0.15mm(6mil) | ||
Min. width of annular ring(finished) | 0.15mm(6mil)/side | ||
Min pad opening | 0.076mm(3mil) | ||
Min S/M Bridge | ±0.076mm(±3mil) | ||
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times | |||
Technology | |||
Min trace/space(inner/external) | 3/3 mil0.075/0.075mm | ||
Min drill size for through hole | drill 8.0 mil0.20mm | ||
Laser dill | 4 mil0.1mm | ||
Copper Foil Thickness | 17-210um | ||
Inner Core Thickness | ±0.08mm | ||
Tolerance of total board thickness | ±0.015mm | ||
Max .Unit Area | 700-800 | ||
Min. Unit Area | 2-5mm | ||
Max Layer | 1-18 Layers | ||
Surface Treatment | |||
Solder Coating Thickness Sn | 4-20um | ||
Cobalt/ Gold plating, Hard Gold Thickness | Ni:5-10umAu:0.05-0.20um | ||
Gold/Nickel Plating Thickness | Ni:5-10umAu:0.05-0.15um | ||
OSP Coating Thickness | 0.2-0.5um | ||
Electroness Au Thickness | Ni:3-15umAu:0.025-0.10mm | ||
Chem .Tin Thickness | Sn:0.8-5um | ||
Producting Capacity | each day :800-100m2 | ||
Aspect Ratio | 6:01:00 | ||
Hole Registration | 0.004" (0.1mm) |
FOUND is a PCB manufacturer providing PCB industry solutions for
customers in the field of templates and small volumes.With high
quality and on time delivery product, we won the market's wide
acclaim.
Base Material:FR-4
Copper Thickness:1oz
Board Thickness:1.6mm
Min. Hole Size:0.25mm
Min. Line Width:3mi
Min. Line Spacing:0.003"
Surface Finishing:HASL
Power:12VA
Usage:consumer electronics,instrument,game player,computer and etc
Product Name:12v power supply pcb
Type:Single Output
Insulation:3KV/5mA
Ripple Wave:1%
Working temperature:0 ~+25
Size:Customized
Input:100-240VAC 102-132VAC 207-153VAC
Protections:Shortcuit Overtemp Overload Overtemp
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