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Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

Brand Name:JIMA
Certification:SGS, ISO,Reach, RoHS
Model Number:EDCU-HC
Minimum Order Quantity:200kg
Delivery Time:5-25days
Payment Terms:T/T, L/C
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Location: Shanghai Shanghai China
Address: No.275,Guoding East Road,Yangpu District,Shanghai Municipality
Supplier`s last login times: within 48 hours
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Product Details

Electrolytic HTE Copper Foil with thickness 35um For PCB laminate Multi-layer printed circuit boards Multi-layer PCB


Detail Specification:

Single side treatment in red. and single Side Shiny
Thickness: 70um and 35um
Width range: 5-1380mm,and standard width:1290mm,max 1380mm width

high temperature elongation copper foil :120 min (180 °C in Atmosphere)

Internal diameter: 3 inch/6 inch.
Standard :IPC-4562

Classify:


1.(STD-E)- standard electrodeposited copper foil.

2.(HD-E)-high ductility electrodeposited copper foil.

3.(HTE-E)-high temperature elongation electrodeposited copper foil.


Copper foil Application

Application2>PCB manufacture
3>antenna PCB

4>PCB laminate

5>Multi-layer printed circuit boards/Multi-layer PCB


Features and advantages

1.The thermally stable microstructures with their stable mechanical properties

2. Improve dimensional stability

3.Reduce bulging, warping and nail head formation.

These resist thermal outliers which typically occur during laminates.


HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thicknessum18253570

IPC 4562

4.6.3.1

Area weightg/m²153±215±5285±5585±8

IPC 4562

4.6.3.2

Roughness(RA)μm0.2-0.40.2-0.40.2-0.40.2-0.4

IPC 4562

4.6.9

(RZ)μm<8.0<9.0≤10.0<15

Copper≧

%99.8

IPC 4562

4.6.3.1

Tensile Strengthstate normalMpa>300>300>300>280

IPC 4562

4.6.4

state temper (180℃)Mpa>18.0>18.0>18.0>18.0
ElongationIstate normal%>5.0>6.0>10.0>10.0

IPC 4562

3.5.3

state temper (180℃)%>2.5>3.0>5.0>5.0
Peel strengthN/mm>1.35>1.70>1.8>2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color changeStandard
SolderabilityGoodStandard
SolderabilityGood

IPC 4562

4.6.12

3. Standard Width,1290(±1)mm,May according to the customer request tailor.


Package detail:wooden box

RFQ:
Q1: What's your guarantee?
A: All our products have 6 months guarantee after received goods, if any quality problem can contact us.
Q2: What's your delivery time ?
A: The common delivery time is 5-25working days. depend on your order quanity
Q4: Can you supply the sample?
A: Yes,We can
Q5. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
Q6. Can you cut into size as request?
Yes, we can.
Q9. Can we come to China visit factory ?
Yes ,you can .
China Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards supplier

Electrolytic HTE Copper Foil thickness 35um For PCB Laminate / Multi Layer Printed Circuit Boards

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