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1.0mm Thickness 0.5oz Turnkey PCB Assembly Min 0201 Chips

1.0mm Thickness 0.5oz Turnkey PCB Assembly Min 0201 Chips

Brand Name:OEM/ODM
Certification:UL,RoHS, CE
Model Number:SL01116S01
Minimum Order Quantity:1pc
Delivery Time:5-7 days
Payment Terms:T/T, Western Union, MoneyGram,Paypal
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Verified Supplier
Location: Shenzhen Guangdong China
Address: Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131
Supplier`s last login times: within 25 hours
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Product Details Company Profile
Product Details

Fast Turnkey PCB Assembly Schematic Diagram Precision Min 0201 Chips PCBA


Production Capability


SHINELINK has invested in the best equipment, environment and staff training. We have a production capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities.


SHINELINK, your single point of contact for all of your raw materials, parts, pcb assembly and finished product assembly, also offers


1. Contract Manufacturing

2. Engineering Services

3. PCB Design & Assembly

4. Product Design

5. Prototyping

6. Cable and Wire Assemblies

7. Plastics and Molds


Shinelink kinds PCBA Products



Feature

Number of Layer1 - 20 Layer
Maximum Processing Area680 × 1000MM
Min Board Thickness2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness ToleranceThickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending≤ 0.75%, Min: 0.5%
Range of TG130 - 215 ℃
Impedance Tolerance± 10%, Min: ± 5%
Hi-Pot TestMax: 4000V/10MA/60S
Surface TreatmentHASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP


PCB Assembly Capabilities

Turnkey PCBAPCB+components sourcing+assembly+package
Assembly detailsSMT and Thru-hole, ISO lines
Lead TimePrototype: 15 work days. Mass order: 20~25 work days
Testing on productsFlying Probe Test, X-ray Inspection, AOI Test, functional test
QuantityMin quantity: 1pcs. Prototype, small order, mass order, all OK
Files we needPCB: Gerber files(CAM, PCB, PCBDOC)
Components: Bill of Materials(BOM list)
Assembly: Pick-N-Place file
PCB panel SizeMin size: 0.25*0.25 inches(6*6mm)
Max size: 20*20 inches(500*500mm)
PCB Solder TypeWater Soluble Solder Paste, RoHS lead free
Components detailsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Component packageCut Tape,Tube,Reels,Loose Parts
PCB assembly
process
Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing



Advantage

1. ISO& UL certified third-party testing and high-quality technical service team.
2. Available and immediate delivery.
3. Producing capacity: 20,000sq meter/month.
4. Competitive price with no MOQ.


FAQ:


1. How do Shinelink keep your price competitive?

Over the last decade, prices of many raw materials (e.g. copper, chemicals) had doubled, tripled or quadrupled; Chinese currency RMB had appreciated 31% over US dollar; And our labor cost also increased significantly.

However, Shinelink have kept our pricing steady. This owns entirely to our innovations in reducing cost, avoiding wastes and improving efficiency. Our prices are very competitive in the industry at the same quality level.

We believe in a win-win partnership with our customers. Our partnership will be mutually beneficial if we can provide you an edgeon cost and quality.


2. What kinds of boards can Shinelink process?

Common FR4, high-TG and halogen-free boards, Rogers, Arlon, Telfon, aluminum/copper-based boards, PI, etc.


3. What data are needed for PCB & PCBA production?

BOM (Bill of Materials) with reference designators: component description, manufacturer’s name and part number.
PCB Gerber files.
PCB fabrication drawing and PCBA assembly drawing.
Test procedures.
Any mechanical restrictions such as assembly height requirements.


4. What’s the typical process flow for multi-layer PCB?

Material cutting → Inner dry film → inner etching → Inner AOI → Multi-bond→ Layer stack up Pressing → Drilling → PTH → Panel Plating → Outer Dry Film → Pattern Plating → Outer etching → Outer AOI → Solder Mask → Component Mark → Surface finish → Routing → E/T → Visual Inspection.


China 1.0mm Thickness 0.5oz Turnkey PCB Assembly Min 0201 Chips supplier

1.0mm Thickness 0.5oz Turnkey PCB Assembly Min 0201 Chips

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