FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services
Brand Name:OEM and ODM
Certification:UL,RoHS, CE
Model Number:SL80815S003
Minimum Order Quantity:1pc
Delivery Time:5-7 days
Payment Terms:T/T, Western Union, MoneyGram,Paypal
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Verified Supplier
Location:
Shenzhen Guangdong China
Address:
Room 201 Building A2 Industrial Park No. 6 Yuanchuang Park Rongfu road, Fucheng Street Longhua District Shenzhen City 518131
Supplier`s last login times:
within 25 hours
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Product Details
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Product Details
FR4 glass epoxy PCB Circuit Board 1 - 18 layers , 1/3 oz - 6 oz
Specifications
FR4 glass epoxy PCB Circuit Board
1.China PCB Factory,not Trading Company
2.No MOQ
3.24 hours for Quote
4.Deliver on Time
We can manufacture PCB and LED PCB in high quality, more competitive price, quicker delivery and better after-sale service.
Quick Details
Place of Origin: | China (Mainland) | Brand Name: | OEM | Model Number: | E020 |
Base Material: | FR4,CEM-1,CEM-3,Teflon,Rogers,Aluminium,High Tg | Copper Thickness: | 1/3 oz- 6 oz | Board Thickness: | 0.2 mm - 6.0 mm |
Min. Hole Size: | 0.2 mm | Min. Line Width: | 3 mil | Min. Line Spacing: | 3 mil |
Surface Finishing: | HASL,LF HASL,ENIG,Gold Finger,Flash Gold,OSP,Carbon,Peelable Mask | Layer: | 2 - 12 layers | Solder Mask: | All kinds of Color |
Impedance Control: | +/- 10% | Product: | FR4 glass epoxy PCB Circuit Board |
PCB Capability
Layer | 1-18 layers |
Board thickness | 0.2-6.0 mm |
Laminates type | FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium, Tg130(150,170,180, 210), Berquist, Thermagon, Alon.Polyclad |
Base copper thickness | Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 210um (6oz) for outer layer |
Min finished hole size | By mechanical drilling: 0.2mm (0.008") |
Aspect ratio | 8:1 |
Max panel size | Mass production: 540mm × 740m (21.25" × 29.13") Sample: 540mm × 1100mm (21.25" × 43.3") |
Min line width/space | 3 mil/3 mil |
Via hole type | Blind, Burried |
Surface finish | HASL/ Lead Free HASL, Immersion Gold / Silver / Tin, Flash Gold, Hard Gold plating, Selective thick Gold Plating, Gold Finger (Gold thickness up to 3um), Plating Silver, Carbon ink, Peelable mark, OSP |
Solder mask | All kinds of colour, LPI, Dry Film, Min S/M pitch (LPI): 0.1mm |
Impedance Control | Single trace or differential controlled 50, 60, 70, 100, 110, 120, 130 ±10% |
Min bonding pitch | 0.181mm (center to center) |
Min SMT pitch | 0.400mm (center to center) |
Min annular ring | 0.025mm |
Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
Tolerances | Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15% Board thickness (1.0 -6.35mm ) ±10% Board Size Routed ± 0.13mm Board Size Scored ± 0.2mm |
Electrical Testing | Voltage: 10V - 250V Continuity: 10 - 1000 Ohms |
PCB Picture
FR4 Glass Epoxy Prototype Circuit Board 1-18 Layers PCB Assembly Services
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