IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent
Brand Name:Tunsing
Certification:SGS , ISO9001
Model Number:DS-4
Minimum Order Quantity:100 Yards
Delivery Time:5-8 work days
Payment Terms:T/T , Western Union, PayPal, L/C
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Location:
Shenzhen Guangdong China
Address:
Tunsing Industrial Zone, No. 28 Xiatian village, Longtian street, Pingshan District, Shenzhen City, Guangdong Province, China
Supplier`s last login times:
within 24 hours
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Product Details
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Product Details
Bonding Temperature 160-180 Degree Card Smart Adhesive Tape for IC cards SIM cards
Description:
The hot melt adhesive is used in the encapsulation of contact smart
card. Excellent adhesion to PVC, FR-4 and other materials.
This product belongs to medium and low temperature hot melt
adhesive tape. The strong cohesive force and good flexibility
ensures that the thrust and bending tests after bonding will not
show any structural fracture while maintaining a balanced bond
strength with the chip and the base. In line with ISO7816 standard
for chip packaging fastness.
Product Image:
Composition:
Polyamide synthesis modification
Physical Characteristics:
Color | Transparent | Release liner | Glassine release paper |
Density | 1.2±0.02g/cm³ | Conventional Thickness | 55±5μm |
Melting point | 100-110℃ | Conventional Width | 29mm |
Melt Flow Index | 110±15g/10min ; Condition: ASTM D1238-04 | Conventional Length | 200m, 300m, 400m |
Finished Products Specification | 55UM*29MM*200M |
Recommended Bonding Conditions:
First Lamination: | Second Implanting: |
Machine Setting: 130℃-150℃ | Machine Setting: 160℃-180℃ |
Dwell Time: 0.6S-1.2S | Dwell Time: 0.6S-1.2S |
Pressure: 0.25-0.4mpa | Pressure: 0.25-0.4mpa |
Applications:
DS-4 is suitable for thermal packaging of IC card, SIM card,
financial social security card and contact bank card
In order to strengthen the management of quality , we purchase many kinds of test equipments.
for example : Melt Flow Index Machine Differential Scanning Calorimetry Peel Force Tester High Low Temperature Tester Chamber Bend Distortion Tester Thrust Tester
Tunsing spirit: innovation, efficiency, dedication Tunsing vision: Become a corporate model based on business principles and corporate ethics Tunsing mission: Improve manufacturing processes and promote social progress through continuous technological innovation Tunsing values: Respect, Integrity Business principles: Provide original solutions for sustainable customer development and build sustainable customer relationships. Environmental Protection: Provide practical and effective products and solutions for ourselves and our customers to meet the needs of the environment.
FAQ :
1 .How about hot melt adhesive film?
A: It is just a film, and the basic material is release paper. But
the film is solid in room temperature, when reach its melt point,
it is able to bond other materials, Different materials of hot melt
adhesive film have different performances and different usages, we
need understand your demands ,then recommend you right products to
you.
2.Do you accept OEM or ODM?
Yes ,we accept OEM and ODM, we are professional heat transfer
material manufacturer ,having more than 10years experience. able to
assist you R&D new products. So if you need bonding some
special materials, please don’t hesitate to let us know.
3.How do you transport the products?
If you are not urgent, we usually transport by ship because it is
the cheapest way. But for the West Asia area,
we deliver by train because there is no sea to ship. And for
samples and urgent cargo, we transport it by air as it is the
fastest way .Of course if you have other better idea about
transport, we will accept it.
4. May I have your samples?
If you need some sample for reference, please let us know your
fully address/ship
mode with courier ,and we will arrange sample for your reference.
5. How long is the lead time?
Sample lead time:3-7 days
Bulk lead time:7-10 days(depends on order quantity)
6. How do I pay for my order?
We accept L/C ,T/T ,Western Union , Paypal , Escrow
Contact Us:
IC / SIM Cards Hot Melt Adhesive Tape Bonding Temp160-180 Degree Transparent
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