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Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

Brand Name:HRT
Certification:ISO9001/ ISO14001/UL/RoHS/REACH
Model Number:A1501 wafer
Minimum Order Quantity:5000 PCS
Delivery Time:5 to 8 working days after payment checked
Payment Terms:TT, Western Union, PayPal, L/C
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Location: Shenzhen Guangdong China
Address: No.A1507H2 Xinhe Century Building, 3069 Caitian Rd, Gangxia Community, Futian District, Shenzhen City, China
Supplier`s last login times: within 24 hours
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Product Details

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors


Description:


1.A1501 series Wafer have A1501WV A1501WR (Single row housing suitable A11501-T series terminal )

2, Wafer used materials:PA6T , Fire-protection rating is UL 94-V0. Minimum packing quantity is 1000pcs/bag.

3. Single row Wafer we have 02PIN~15PIN ,The daily production capacity is 30 to 50 KPCS.

4.Terminals are stamped by Phosphor Bronze, E-Stamping beforeTin-plated , Tin-plated we calling A1501-TPe , Minimum packing quantity is 20,000pcs/Reel. The daily production capacity is 300 to 400 KPCS.

5.Terminals' wire range :AWG #22--#28insulation OD is0.90mm(Max).


Test DescriptionProcedureRequirement

Contact Resistance

Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)20mΩ (Max.)
Insulation ResistanceMate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)1000MΩ (Min.)
Dielectric Withstanding VoltageMate connectors, apply 800V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301))No Breakdown.
Contact Resistance on Crimped PortionCrimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.5mΩ (Max.)

Current rated
3A AC/DC maximum
Voltage rated350V AC/DC
Withstand voltage500V AC/minute
Insulation resistance1000MΩ min
Contact resistance20MΩ max
Operating temperature-25 - 85°C


Environmental Performance And Others


Test DescriptionProcedureRequirement
6-1Temperature RiseCarrying rated current load.(Based upon UL 498)30℃(Max.)
6-2Heat Resistance85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

6-3Cold Resistance-25±3℃,96 hours (Based upon JIS C0020)
6-4Humidity

Temperature: 40±2℃

Relative Humidity : 90~95%

Duration: 96 hours

(Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

Insulation Resistance 100MΩ (Min.)

Dielectric Withstanding Voltage Must meet 4-3

6-5Temperature Cycling

5 cycles of:

a) -55℃ 30 minutes

b) +85℃ 30 minutes

(Based upon JIS C0025)

Appearance No Damage.

Contact Resistance 40mΩ (Max.)

6-6Salt SprayTin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
6-7SO2 Gas

24 hours exposure to 50±5ppm.

SO2 gas at 40±2℃.

6-8NH3 Gas40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
6-9Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes
6-10Resistance to Soldering Heat

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

Actuator Insertion/Withdrawal Force

[Unit : kgf]

CircuitsAt Initial
Insertion (Max.)Withdrawal (Min.)
Single0.700.06
022.500.30
033.000.40
043.500.50
054.000.60
064.500.70
075.000.80
085.500.90
095.501.00
106.001.10
116.001.20
126.501.30
136.501.40
147.001.50
157.001.60

China Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors supplier

Wafer Connector Pitch 1.50mm Pin Brass/ Tin-plated wire to board connectors

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