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Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

Brand Name:XCE
Certification:CE,ROHS, FCC,ISO9008,SGS,UL
Model Number:XCEP
Minimum Order Quantity:1pcs
Delivery Time:5-10 days
Payment Terms:T/T,Western union
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Location: Shenzhen Guangdong China
Address: Room 403 Block A,Huafeng SOHO Creative World Hangcheng Industrial Zone Qianjin 2nd Road,Xixiang Baoan Shenzhen,China
Supplier`s last login times: within 27 hours
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Product Details

Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried ​


Application:


Automobile

Backplanes

Servers and Networking

Telecommunications

Data Storage

Heavy Copper Application


Specification:


Base Material: fr4
Layer:2
Thickness: 1.0MM
Copper weight:2OZ
Surface finish: ENIG

High frequency:


ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2

Specification:

Technology

Materials

  • Multilayer PCBs with 18 layers
  • Teflon

PCB thickness

Final copper

  • 2.6 mm
  • 1OZ

Conductor track widths

Minimum drilling diameter

  • ≥ 90 µm
  • 0.2 mm

Contour production

Solder masks

  • Milling
  • Scoring
  • Photosensitive solder mask systems
  • UV solder mask system, screen printing

Surfaces

Additional printing



  • Immersion gold
  • Identification printing, inkjet
  • Component printing, screen printing
  • Through-hole printing
  • Peelable solder mask (green mask)
  • Masking tape
  • Plugging









Layer

12-26

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

0.21mm to 7.0mm

Copper thickness

0.5 OZ to 6 oz

Size

Max. Board Size: 580mm×1100mm

Min. Drilled Hole Size: 0.2 mm (8 mil)

Min. Line Width: 4mil (0.1mm)

Min. Line Spacing: 4mil (0.1mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin,
Immersion Silver/Gold, OSP, Gold plating

Solder Mask Color

Green/Yellow/Black/White/Red/Blue

Tolerance

Shape tolerance: ±0.13

Hole tolerance: PTH: ±0.076 NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling


Why us ?


1)Professional engineer team --help you to check design and do engineering before production

2)Rich expierences in pcb production industry--provide high quality and competitive price pcb.

3) After-sales service--every problem you have will get our professional advice and solution.

4) Constant follow up-- make us have the fast reaction of your requirement.

5) Inspected by the Inspection Institution--ISO,UL,ROHS cerfiticated


Our PCB - Printed Circuit Board capabilities include:

  • One to Thirty Layers
  • Rigid Flex Circuit Board
  • One to Eight layer flexible PCB
  • Hybrid constructions PCB
  • Metal core (Aluminum)
  • PCB up to 6 oz inner layer
  • Finishes: HASL, HASL (Pb-free), Soft Bondable Gold, Electrolytic Gold, Immersion Gold, Immersion Silver, Immersion Tin, OSP.
  • Materials: Polyimide, Arlon, Nelco, Rogers, Getek, Polyclad
  • Impedance Control and Blink/Buried Vias, HDI, Microvias
  • RoHS Compliant (RoHS – Restrictions on the use Of Hazardous Substances)


China Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried supplier

Impedance Control Prototype PCB Boards Green 1.0MM Blink / Buried

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