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Rogers4350B Board Without Soldermask For Microwave/RF Applications
0.79MM Thickness
Specifiction:
layer:6
board thickness:0.79mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:5/5mil
Surface treatment: imersion Tin
Application: Microwave/RF
Product Description
L1-L2 Blind holes;
L2-L3 Bury holes;
L1-L4 Through holes;
Copper based with Rogers 4350 T1.3mm.
Copper thickness 0.70mm;
Milling thickness 1.2mm.
Description :
RO4350B materials are proprietary woven glass reinforced
hydrocarbon/ceramics with electrical performance close to
PTFE/woven glass and the manufacturability of epoxy/ glass.
Providing tight control on dielectric constant and low loss while
utilizing the same processing method as standard epoxy/glass,
RO4350B is available at a fraction of the cost of conventional
microwave laminates. No special through-hole treatments or handling
procedures are required as with PTFE based microwave materials.
RO4350B materials are UL 94V-0 rated for active devices and high
power RF designs.
Specification
PCB Type: | Rogers PCB |
Layer : | 6 layer |
Min .Line Width/Space: | 5mil/5mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 0.2mm |
Surface Finish: | Immersion Tin |
Size: | 101*150MM |
Material: | Rogers |
Color: | / |
Application | Microwave/RF |
Rogers material in stock:
Brand | Model | Thickness(mm) | DK(ER) |
F4B | F4B | 0.38 | 2.2 |
F4B | 0.55 | 2.23 | |
F4B | 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 | 2.65 | |
F4Bk | 0.8,1.5 | 2.65 | |
F4B | 0.8 | 3.5 | |
FE=F4BM | 1 | 2.2 | |
Rogers | RO4003 | 0.254 0.508,0.813,1.524 | 3.38 |
RO4350 | 0.254 0.508,0.762,1.524 | 3.5 | |
RO5880 | 0.254.0.508.0.762 | 2.2 | |
RO3003 | 0.127,0.508,0.762,1.524 | 3 | |
RO3010 | 0.635 | 10.2 | |
RO3206 | 0.635MM | 10.2 | |
R03035 | 0.508MM | 3.5 | |
RO6010 | 0.635MM, 1,27MM | 10.2 |
Our PCB board manufacture
* PCB board file with parts list provided by customers
* PCB board made, circuit board parts purchased by us
* Electronic testing circuit board
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
Testing Procedures For PCB Board
---We perform multiple quality assuring procedures before shipping
out any PCB board. These include:
* Visual Inspection
* Flying probe
* Bed of nails
· * Impedance control
· * Solder-ability detection
* Digital metallograghic microscope
· *AOI (Automated Optical Inspection)
Available substrates:
RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE
4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)
10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)
13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)
20mil (0.508mm) 32mil(0.813mm)
30mil(0.762mm) 60mil(1.524mm)
60mil(1.524mm)
Applications:
Amplifier Combiner Coupler Mixer Multiplexer Power divider WiFi
WiMAX, LTE bands 3G and 4G antenna
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.