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Rigid 8 Layer PCB , Mobile Terminal Device Printed Circuit Board PCB

Rigid 8 Layer PCB , Mobile Terminal Device Printed Circuit Board PCB

Brand Name: XCE
Certification: CE,FCC,Rohs,ISO9001,SGS,UL
Model Number: XCER
Minimum Order Quantity: 1PCS
Payment Terms: Western Union, L/C, T/T
Place of Origin: China
Shenzhen Xinchenger Electronic Co.,Ltd
Verified Supplier
Shenzhen Guangdong China
Business type: Manufacturer
515B,BldA,Zhuhuichuangxin Center,Xixiang,Baoan,Shenzhen,China
Supplier`s last login times: within 28 hours

Rigid 8 Layer PCB , Mobile Terminal Device Printed Circuit Board PCB​


Specification:


Base Material: FR4
Layer:8
Thickness: 0.6MM
Copper weight:1OZ
Surface finish: HASL

Features:


Base Material: Aluminum/FR4/CEM1/CEM3

Layer: 1 layer/2 layers

Board Thickness: 0.3-3mm

Min.Board Dimension: 4x4mm

Max.Board Dimension: 1500x600mm

Copper layer: 1oz/2oz/3oz

Solder Mask: White/Black/Blue/Red

Silkscreen: Black/White

Surface finish: LF HAL/HAL/OSP/Gold immersion/Silver plating

Outline Profile: CNC routing/V-Cut/Punching

All of the parameters can be customized!


Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.


Parameter:


Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm


Product Tags:

printed circuit board pcb

      

high speed pcb layout

      

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