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Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S

Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S

Brand Name:ZIITEK
Certification:UL and RoHs
Model Number:TIF100-07S
Minimum Order Quantity:1000pcs
Delivery Time:3-5work days
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Supplier`s last login times: within 1 hours
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Product Details

Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S

The TIF100-07S is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features:
> Good thermal conductive:1.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Moldability for complex parts
> RoHS compliant

>Easy release construction

Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF™100-07S Series
Color

Green

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm0.21
20mils / 0.508 mm0.27
Specific Gravity
2.80 g /ccASTM D297

30mils / 0.762 mm

0.39

40mils / 1.016 mm

0.43
Heat Capacity
1 l /g-KASTM C351

50mils / 1.270 mm

0.50

60mils / 1.524 mm

0.58

Hardness
45 Shore 00ASTM 2240

70mils / 1.778 mm

0.65

80mils / 2.032 mm

0.76
Tensile Strength

55 ps

ASTM D412

90mils / 2.286 mm

0.85

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.00

120mils / 3.048 mm

1.07
Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.16

140mils / 3.556 mm

1.25
Dielectric Constant
7.5 MHzASTM D150

150mils / 3.810 mm

1.31

160mils / 4.064 mm

1.38
Volume Resistivity
8X1012Ohm-meterASTM D257

170mils / 4.318 mm

1.43

180mils / 4.572 mm

1.50
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.60

200mils / 5.080 mm

1.72
Thermal conductivity
1.5 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470
Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:

TIF™ series sheets type can add with fiberglass reinforced.

Our services


Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples


After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.


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A:1. Click the "Sent messages" button to continue with the process.

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China Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S supplier

Ultrasoft CPU Heatsink Pad Thermal Gap Filler 1.5 W/m-K Green Thermal Silicone Pads 45 Shore 00 TIF100-07S

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