High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60～250℃ UL94 V-0
Brand Name:ziitek
Certification:RoHs
Model Number:TIS580-12
Minimum Order Quantity:25PC
Delivery Time:2-3 work days
Place of Origin:China
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Dongguan Guangdong China
Address:
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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Product Details
High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60～250℃
TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-12 Series Datasheet-(E)-REV01.pdf
Feature
Good thermal conductivity: 1.2W/mK
Good maneuverability and good adhesion
Low shrinkage
Low viscosity, leads to void-free surface
Good solvent resistance, water resistance
Longer working life
Excellent thermal shock resistance
Application
It mainly used in substituting thermally-conductive paste and pads,
which currently finds in gap-filling adhesives or heat conduction
between LED aluminium motherboard and heat sink, high power
electrical module and heat sink. Traditional methods such as fins
and screws fixing can be replaced by applying TIS580-13, resulting
a more reliable gap-filling thermal conduction, simplified handling
and more cost-effective.
E.g. Massive application in integrated circuits in portable
computer, microprocessor, high power LED, internal storage module,
cache, integrated circuits, DC/AC translator, IGBT and other power
modules, encapsulation of semi-conductors, relay switches,
rectifiers and transfomers
| To potting LED Lighting heat spreader and power- driver. |
| Ferrite cements |
| Relay sealant |
| Power transformers and coils |
| Adhesion to metal glass and plastic |
| tip type LED |
| PCB and plastics |
| small electrical devices |
| IGBTS |
| Transformer |
| LED Power Supply |
| LED Controller |
| LED Lights |
| LED Ceilinglamp |
| Monitoring the Power Box |
| AD-DC Power Adapters |
| Rainproof LED Power Supply |
| Waterproof LED Power Supply |
| Piranha wroof and common lED module |
| Typical values of TISTM580-12 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25℃) | 1.3 | ASTM D297 |
| Tack-free time(min,25℃) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25℃ Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25℃) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | ＞3.5 | ASTM D1876 |
| Operation temperature(℃) | -60～250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.2 | ASTM D5470 |
| Flame Retardancy | UL94 V-0 | E331100 |
High Adhesion And Insulation TIS580-12 White Silicone Thermally Conductive Adhesive 1.2W/mK -60～250℃ UL94 V-0
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