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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Brand Name:Ziitek
Certification:RoHs
Model Number:TIE™ 280-25AB
Minimum Order Quantity:2kg/LOT
Delivery Time:2-3 work day
Place of Origin:China
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Location: Dongguan Guangdong China
Address: Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Supplier`s last login times: within 1 hours
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Product Details

2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature


TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.


TIE280-25 A&B.pdf


Features

> Good thermal conductive: 2.5W/mK

> Excellent insulation and smoothly sourface.

> Low shrinkage

> Low viscosity, expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.

> Excellent thermal shock efficiecy and impact resistance


Application


> Automotive starters potting; General potting Thermal detector potting

> Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

> Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

> Power transformers and coils; Potting capacitors Potting of small electrical devices

> Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

> Optical / medical component adhesive


Typical Uncured Material TIE™ 280-25A (Resin)
ColorBlack
Viscosity@25℃ Brookfield3,000 cPs
Specific Gravity2.1 g/cc
Shelf life @25℃ in sealed container12 months
TIE™ 280-25B (Hardener)
ColorBlack
Viscosity@25℃ Brookfield5,000 cPs
Shelf life @25℃ in sealed container12 months n

Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃4,000 cPs
Working pot life (250 g @25℃)45 min
Specific Gravity2.1g/ccn
Cure Schedule
Cure 12 hours at 25℃
Cure 30 minutes at 70℃

Cured Properties
Hardness @25℃85 Shore D
Service temperature-40℃ to +130℃
Glass transition temperature Tg92℃
Elongation0.10%
Coefficient of thermal expansion, / ℃3.0 X 10-5
Fire resistance ULMeet 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃0.1

Thermal
Thermal Conductivity2.5 W/m-K
Thermal Impedance @10psi0.31 ℃-in²/W
ELECTRICAL AS CURED
Dielectric Strength300 volts / mil
Dielectric Constant4.2 MHz
Dissipation factor0.029 MHz
Volume resistivity, ohm-cm @ 25℃3.0 X 1012

China 2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D supplier

2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

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