Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK
Brand Name:Ziitek
Certification:RoHs
Model Number:TIA800FG
Minimum Order Quantity:10SQM
Delivery Time:2-3Work day
Place of Origin:China
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Dongguan Guangdong China
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Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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Product Details
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
TIA800FG Series Datasheet-(E)-REV01.pdf
Features
> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided
pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor
control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or
clip mounting
| Typical Properties of TIA™800FG Series | |||||||
| Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
| Color | White | Visual | |||||
| Adhesive Type | Acrylic Adhesive | ******** | |||||
| Backing Type | Glass fiber | ******** | |||||
Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.020" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
Aluminum Foil Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch2 | JIS K02378 | |||||
Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 | |||||
| Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 | |||||
Recommend Using Pressure | 10 psi | ******** | |||||
| Thermal Conductivity | 0.8 W/mK | ******** | |||||
Thermal Impedance @50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.
Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
Blue Low Thermal Impedance Thermal Adhesive Tape for Bonding Heat Dissipation Fins 10" x 400' Sizes 0.8 W/mK
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