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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial

Brand Name: NXP
Certification: CE,ROHS
Model Number: LPC1114FHN33/302:5
Minimum Order Quantity: 1pcs
Delivery Time: 2-4 working days after receiving the payment
Payment Terms: T/T, Western Union,paypal
TOP Electronic Industry Co., Ltd.
Verified Supplier
China
Business type: Manufacturer
RM201,40TH Bldg,Nan hua zone,Futian Dist.Shen Zhen,China
Supplier`s last login times: within 35 hours

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial


Description:

• System:

– ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.

– ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).

– Serial Wire Debug.

– System tick timer.


• Memory:

– On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C

series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB

(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).

– On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB

(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),

56 kB (LPC1114/333), 64 kB (LPC1115).

– 8 kB, 4 kB, 2 kB, or 1 kB SRAM.

– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip

bootloader software.

– LPC1100XL series only: page erase IAP command.


• Digital peripherals:

– Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down

resistors. Number of GPIO pins is reduced for smaller packages and

LPC11C22/C24.

– GPIO pins can be used as edge and level sensitive interrupt sources.

– High-current output driver (20 mA) on one pin.

– High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.

– Four general purpose timers/counters with a total of four capture inputs and up to

13 match outputs.

– Programmable WatchDog Timer (WDT).


• Analog peripherals:

– 10-bit ADC with input multiplexing among up to 8 pins.


• Serial interfaces:

– UART with fractional baud rate generation, internal FIFO, and RS-485 support.

– Two SPI controllers with SSP features and with FIFO and multi-protocol

capabilities (second SPI on LQFP48 packages only).

– I

2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a

data rate of 1 Mbit/s with multiple address recognition and monitor mode.

– C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.

– On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).


• Clock generation:

– 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used

as a system clock.

– Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.

User manual Rev. 12.3 — 10 June 2014 7 of 547

NXP Semiconductors UM10398

Chapter 1: LPC111x/LPC11Cxx Introductory information

– Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.

– PLL allows CPU operation up to the maximum CPU rate without the need for a

high-frequency crystal. May be run from the system oscillator or the internal RC

oscillator.

– Clock output function with divider that can reflect the system oscillator clock, IRC

clock, CPU clock, and the Watchdog clock.


• Power control:

– Integrated PMU (Power Management Unit) to minimize power consumption during

Sleep, Deep-sleep, and Deep power-down modes.

– Power profiles residing in boot ROM allowing to optimize performance and

minimize power consumption for any given application through one simple function

call. (On LPC1100L and LPC1100XL parts only).

– Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.

– Processor wake-up from Deep-sleep mode via a dedicated start logic using up to

13 of the functional pins.

– Power-On Reset (POR).

– Brownout detect with up to four separate thresholds for interrupt and forced reset.


• Unique device serial number for identification.

• Single 3.3 V power supply (1.8 V to 3.6 V).

• Available as LQFP48 package, HVQFN33 package.

• LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,

TSSOP20 package, and SO20 package.

• Available as dual-chip module consisting of the LPC1114 single-chip microcontroller

combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part

LPC11D14FBD100/302).1


Specification:

Standard package

260pcs/tray

Category

Integrated Circuits (ICs)

Family

Embedded - Microcontrollers

Series

LPC1100L

Packaging

Tray

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, SPI, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

1.8 V ~ 3.6 V

Data Converters

A/D 8x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C

Package / Case

32-VQFN Exposed Pad

Supplier Device Package

32-HVQFN (7x7)


Ordering Information:

Type number

Package

Description

Version

SO20, TSSOP20, TSSOP28, and DIP28 packages

 

LPC1110FD20

SO20

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

LPC1111FDH20/002

TSSOP20

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

LPC1112FD20/102

SO20

SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm

SOT163-1

LPC1112FDH20/102

TSSOP20

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

LPC1112FDH28/102

TSSOP28

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

LPC1114FDH28/102

TSSOP28

TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm

SOT361-1

LPC1114FN28/102

DIP28

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

HVQFN24/33, LQFP48, and TFBGA48 packages

 

LPC1111FHN33/101

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111JHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1111JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/101

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN24/202

HVQFN24

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm

SOT616-3

LPC1112FHI33/102

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHI33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112JHI33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1112FHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112JHN33/103

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1112FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113JHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/201

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/202

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/301

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHI33/302

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHI33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1114JHI33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm

n/a

LPC1114FHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/203

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/303

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114FHN33/333

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1114JHN33/333

HVQFN33

HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm

n/a

LPC1113FBD48/301

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113FBD48/302

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113FBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1113JBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/301

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/302

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114JBD48/303

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2

LPC1114FBD48/323

LQFP48

LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´

SOT313-2


Product Tags:

electronic integrated circuits

      

ARM Flash

      

NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial Images

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