PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing
Brand Name:HUASWIN
Certification:ISO/UL/RoHS
Model Number:HSPCBA1016
Minimum Order Quantity:1 sets
Delivery Time:15-20 working days
Payment Terms:T/T, Western Union, L/C
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Product Details
Chip On Board Assembly PCB CEM-3 Material Multilayer Lead Free HASLSurface Finishing Green Sold Mask White Silkscreen
FAQ
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, PNP and Components Position
Q:Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test
procedure?
A: Within 6 hours for PCB quotation and around 24-48 hours for PCBA
quotation.
Q: How can I know the process of my PCB production?
A: 5-7days for PCB production and components purchasing, and 14
days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB products work well before
shipping. We'll test all of them according to your test procedure.
Detailed Specification of PCB Manufacturing
| 1 | layer | 1-30 layer |
| 2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
| 3 | Board thickness | 0.2mm-6mm |
| 4 | Max.finished board size | 800*508mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | min.line width | 0.075mm(3mil) |
| 7 | min.line spacing | 0.075mm(3mil) |
| 8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
| 9 | Copper thickness | 0.5-4.0oz |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
| 15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
| 1 | Type of Assembly | SMT and Thru-hole |
| 2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
| 3 | Components | Passives Down to 0201 Size |
| BGA and VFBGA | ||
| Leadless Chip Carries/CSP | ||
| Double-Sided SMT Assembly | ||
| Fine Pitch to 08 Mils | ||
| BGA Repair and Reball | ||
| Part Removal and Replacement-Same Day Service | ||
| 3 | Bare Board Size | Smallest:0.25x0.25 Inches |
| Largest:20x20 Inches | ||
| 4 | File Formats | Bill of Materials |
| Gerber Files | ||
| Pick-N-Place File(XYRS) | ||
| 5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
| 6 | Component Packaging | Cut Tape |
| Tube | ||
| Reels | ||
| Loose Parts | ||
| 7 | Turn Time | 15 to 20 days |
| 8 | Testing | AOI inspection |
| X-Ray inspection | ||
| In-Circuit testing | ||
| Functional test |
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30
layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Chip On Board Assembly Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Testing:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming
PCB CEM-3 Chip On Board Assembly Multilayer Lead Free HASL Surface Finishing
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