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Immersion Gold PCB Flexible Printed Circuit Board For Mobile Keypad

Immersion Gold PCB Flexible Printed Circuit Board For Mobile Keypad

Brand Name:HUASWIN
Certification:ISO/UL/RoHS
Model Number:HSFPC1006
Minimum Order Quantity:1 sets
Delivery Time:15-20 working days
Payment Terms:T/T, Western Union, L/C
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Product Details

OEM FPC Board with Immersion Gold Flexible Printed Circuit Board For Mobile Keypad


Product Description

Huaswin Electronics Co, . Ltd is an experienced PCB and PCBA manufacturer in Shenzhen, China. After several years' developing and improving, our company establishes our main business in three principal areas-Printed Circuit Boards, PCB Assembly and Components Procurement. From prototype to mass production, we are able to gurantee a complete service with technical back up, offering a cost advantage and continuity of supply.
Our aim: High quality, low cost & fast delivery for Flexible PCB(FPC) and PCB Assembly.
Service: One-stop-service for Flexible PCB(FPC) and PCBA Assembly.
Verification: UL, ISO, RoHS
Product Name: High Quality Flexible PCB, Rigid Flex FPC
Specifications:
1. Certificate of UL, ISO9001, TS16949.
2.4-5 days fast Flexible PCB(FPC) and PCB delivery
3. Our Products meet the RoHS & HASL lead-free requirement.
4. Minimum Order: 1 Pieces
5. Flexible PCB(FPC) and PCB manufacturer

Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.

Detailed Specification of Flexible PCB Manufacturing

Technical Specification

Layers:

1~10 (flex Pcb) and 2~8 (rigid flex)

 

Min Panel Size:

5mm x 8mm

 

Max Panel Size:

250 x 520mm

 

Min Finished board thickness:

0.05mm (1 sided inclusive copper)

 

Max Finished board thickness:

0.3mm (2 sided inclusive copper)

 

Finished board thickness tolerance:

±0.02~0.03mm

 

Material:

Kapton, Polyimide, PET

 

Base copper thickness (RA or ED):

1/3 oz, 1/2 oz, 1oz, 2oz

 

Base PI thickness:

0.5mil, 0.7mil, 0.8mil, 1mil, 2mil

 

Stiffner:

Polyimide, PET, FR4, SUS

 

Min Finished hole diameter:

Φ 0.15mm

 

Max Finished hole diameter:

Φ 6.30mm

 

Finished hole diameter tolerance (PTH):

±2 mil ( ±0.050mm)

 

Finished hole diameter tolerance (NPTH):

±1 mil ( ±0.025mm)

 

Min width/spacing (1/3oz):

0.05mm/0.06mm

 

Min width/spacing (1/2oz):

0.06mm/0.07mm

 

Min width/spacing (1oz):

Single layer: 0.07mm/0.08mm

 

Double layer: 0.08mm/0.09mm

 

Aspect Ratio

6:01

8:01

Base Copper

1/3Oz--2Oz

3 Oz for Prototype

Size Tolerance

Conductor Width:±10%

W ≤0.5mm

Hole Size: ±0.05mm

H ≤1.5mm

Hole Registration: ±0.050mm

 

Outline Tolerance:±0.075mm

L ≤50mm

Surface Treatment

ENIG: 0.025um - 3um

 

OSP:

 

Immersion Tin: 0.04-1.5um

 

Dielectric Strength

AC500V

 

Solder Float

288℃/10s

IPC Standard

Peeling Strength

1.0kgf/cm

IPC-TM-650

Flammability

94V-O

UL



PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material

Testing Methods
AOI Testing
· Checks for solder paste
· Checks for components down to 0201"
· Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
· BGAs
· Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by
component problems.
· Power-up Test
· Advanced Function Test
· Flash Device Programming
· Functional testing


Detailed Specification of Pcb Assembly

1

Type of Assembly

SMT and Thru-hole

2

Solder Type

Water Soluble Solder Paste,Leaded and Lead-Free

3

Components

Passives Down to 0201 Size

BGA and VFBGA

Leadless Chip Carries/CSP

Double-Sided SMT Assembly

Fine Pitch to 08 Mils

BGA Repair and Reball

Part Removal and Replacement-Same Day Service

3

Bare Board Size

Smallest:0.25x0.25 Inches

Largest:20x20 Inches

4

File Formats

Bill of Materials

Gerber Files

Pick-N-Place File(XYRS)

5

Type of Service

Turn-Key,Partial Turn-Key or Consignment

6

Component Packaging

Cut Tape

Tube

Reels

Loose Parts

7

Turn Time

15 to 20 days

8

Testing

AOI inspection

X-Ray inspection

In-Circuit testing

Functional test


China Immersion Gold PCB Flexible Printed Circuit Board For Mobile Keypad supplier

Immersion Gold PCB Flexible Printed Circuit Board For Mobile Keypad

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