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Welcome to PCB Technologies Manufacturer !
Our WonDa advantage
1. Excellent quality and competitive price ;
2. High Technology Capability: Min: 3mil/3mil trace/space, Min
drill: 4mil .up to 30 layers.
3. Fast and timely delivery.
4. Related Quality certification: UL E320829 / ISO9001 / TS16949
Our products are used to :
Telecommunication equipment,Electric equipment,Industrial control,Digital,
Transportation,Medical instruments,and Led/wireless products field etc.
We Multech offering Rigid, Flex and Flex-Rigid PCB to our customers all over the world !
Multech Rigid Capability | |
Laminates type | FR-4,CEM-1,CEM-3,BT Resin, Teflon,PTFE,Halogen Free |
Rogers,Aluminium, Tg130°C(150°C,170 °C,180 °C 210°C), Berquist, Thermagon,Alon.Polyclad | |
Board thickness | Min: 2-Layer: 0.2 mm -6.0 mm 4-Layer: 0.40mm -8.0mm 6-Layer: 0.8 mm -8.0 mm 8-Layer: 1.0 mm -8.0mm 10-Layer: 1.2 mm -8.0 mm 12-Layer: 1.5 mm -8.0mm Max: 8mm (0.3150") |
Base copper thickness | Mass production: Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer Sample: Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer |
Min finished hole size | By mechanical drilling: 0.15mm (0.006") |
By laser drilling: 0.05mm (0.002") | |
Aspect ratio | 12:01 |
Max panel size | Mass production, 540mm × 740m (21.25" × 29.13") |
Sample: 700mm × 1100mm (27.56" × 43.3") | |
Min line width/space | Mass production: 3mil/3mil |
Sample: | |
Inner layer: 0.0635mm/0.0635mm (0.0025"/0.0025") | |
Outer layer: 0.0585mm/0.0585mm (0.0023"/0.0023") | |
Via hole type | Blind/Burried/Plugged |
HDI/Microvia | YES |
Surface finish | HASL / Lead Free HASL |
Immersion Gold / Silver / Tin | |
Flash Gold. Hard Gold plating | |
Selective thick Gold Plating | |
Gold Finger (Gold thickness up to 3um) | |
Plating Silver (Silver through Hole, | |
Carbon ink, Peelable mark, OSP | |
Solder mask | All kinds of colour |
LPI, Dry Film | |
Min S/M pitch (LPI): 0.1mm | |
Impedance Control | Single trace or differential controlled |
50, 60, 70, 100, 110, 120, 130 ±5% | |
Min bonding pitch | 0.181mm (center to center) |
Min SMT pitch | 0.400mm (center to center) |
Min annular ring | 0.025mm |
Outline finish type | CNC Routing; V-Scoring/Cut; Punch |
Tolerances | Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15% Board thickness (1.0 -6.35mm ) ±10% Board Size Routed ± 0.1mm Board Size Scored ± 0.2mm |
Electrical Testing | Voltage 10V - 250V Continuity 10 - 1000 Ohms |
Multech Production capacity is 15000 square meter monthly.
Layers ------------------Express lead time-----------Standard L/T of mass production
Double Sided:-------------------5 Calendar days ------------------10 Calendar days
4 Layers:---------------------------7 Calendar days ------------------12 Calendar days
6 Layers:---------------------------9 Calendar days -----------------15 Calendar days
8 Layers: --------------------------12 Calendar days ----------------19 Calendar days
10 Layers: ------------------------15 Calendar days -----------------20 Calendar days
10 Layers above: -------------17above Calendar days --------21-25 Calendar days