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UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules

China UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules on sale
5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45 Shore00 With Grey Colour For RDRAM Memory Modules 5W / MK,UL recognized thermal conductive gap filler 45 shore00 with grey colour For RDRAM memory modules The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal conductivity of 5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

DS3231 AT24C32 IIC Clock Timing IC Memory Module Beats Replace DS1307 I2C RTC Board (No Battery)

China DS3231 AT24C32 IIC Clock Timing IC Memory Module Beats Replace DS1307 I2C RTC Board (No Battery) on sale
DS3231 AT24C32 IIC RTC Module Clock Timer Memory Module Beats Replace DS1307 I2C RTC Board (no battery) * DS3231 16-pin memory chips - AT24C32, extremely accurate I2C real-time clock (RTC), with an integrated temperature-compensated crystal oscillator (TCXO) and crystal. * Integrated oscillator improves the long-term accuracy of the device and reduces the number of components of the production line. * Provides two configurable alarm clocks and a...
Muz Tech Co.,Ltd
Verified Supplier
China, Hunan, Changsha, Room 29030, Building 2, Fudi Xingguang Commercial Plaza, No. 80, Xiangfu Middle Road

DS3231 RTC Module Clock Timing IC Memory Module For Timekeeping Beats Function

China DS3231 RTC Module Clock Timing IC Memory Module For Timekeeping Beats Function on sale
DS3231 AT24C32 IIC RTC Module Clock Timer Memory Module for Timekeeping Beats Function #detail_decorate_root .magic-0{border-bottom-style:solid;border-bottom-color:#53647a;font-family:Roboto;font-size:24px;color:#53647a;font-style:normal;border-bottom-width:2px;padding-top:8px;padding-bottom:4px}#detail_decorate_root .magic-1{vertical-align:top}#detail_decorate_root .magic-2{vertical-align:top;display:block;padding-right:4px;box-sizing:border-box...
Muz Tech Co.,Ltd
Verified Supplier
China, Hunan, Changsha, Room 29030, Building 2, Fudi Xingguang Commercial Plaza, No. 80, Xiangfu Middle Road

Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc

China Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc on sale
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc The TIF™500 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF™500 is an electrically isolating material, which allows its use in applications requiring isolation...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00

China Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 on sale
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 The TIF™100-50-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Compressible 1.5w / Mk blue Thermal Gap Filler For Memory Modules TIF100-15-05S silicone gap pad -50 to 200℃

China Compressible 1.5w / Mk blue Thermal Gap Filler For Memory Modules TIF100-15-05S silicone gap pad -50 to 200℃ on sale
Compressible 1.5w / Mk Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules 

China China company supplied Heatsink Cooling 4W Thermal Gap Filler  Ultra soft Low Thermal Resistance for Memory Modules  on sale
China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules

China TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules on sale
TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. The TIF100-25-11S Series thermally conductive...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness

China Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness on sale
Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness The TIF100-40-14S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City

Customerized Ultra Soft 35 Shore00 1.5W Pink Thermal Conductive Gap Filler Pad 2.34 G/Cc For Memory Modules

China Customerized Ultra Soft 35 Shore00 1.5W Pink Thermal Conductive Gap Filler Pad 2.34 G/Cc For Memory Modules on sale
Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements...
Dongguan Ziitek Electronic Materials & Technology Ltd.
Verified Supplier
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
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