1 - 10 Results for 1gb memory module from 11135 Products
UL Recognized Thermal Conductive Gap Filler 4.5mmT For RDRAM Memory Modules
5W / MK,UL Recognized Thermal Conductive Gap Filler 4.5mmT,45 Shore00 With Grey Colour For RDRAM Memory Modules 5W / MK,UL recognized thermal conductive gap filler 45 shore00 with grey colour For RDRAM memory modules The TIF5180-50-11US iis an extremely soft gap filling material rated at a thermal conductivity of 5 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
DS3231 AT24C32 IIC Clock Timing IC Memory Module Beats Replace DS1307 I2C RTC Board (No Battery)
DS3231 AT24C32 IIC RTC Module Clock Timer Memory Module Beats Replace DS1307 I2C RTC Board (no battery) * DS3231 16-pin memory chips - AT24C32, extremely accurate I2C real-time clock (RTC), with an integrated temperature-compensated crystal oscillator (TCXO) and crystal. * Integrated oscillator improves the long-term accuracy of the device and reduces the number of components of the production line. * Provides two configurable alarm clocks and a...
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc
Violet Silicone Soft Thermal Conductive Pad for RDRAM Memory Modules 2.6W/mK, 35 Shore00, 2.80 g/cc The TIF™500 Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF™500 is an electrically isolating material, which allows its use in applications requiring isolation...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00
Gray LED High Temperature Thermally Conductive Pad Heat Dissipation 5W / mK for RDRAM memory modules 60 Shore 00 The TIF™100-50-10F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Compressible 1.5w / Mk blue Thermal Gap Filler For Memory Modules TIF100-15-05S silicone gap pad -50 to 200℃
Compressible 1.5w / Mk Thermal Gap Filler , Heat Conductive Materials For Memory Modules Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules
China company supplied Heatsink Cooling 4W Thermal Gap Filler Ultra soft Low Thermal Resistance for Memory Modules The TIF100-40-12U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules
TIF100-25-11S Non Toxic 40 Shore 00 2.5W/m-K Silicone Thermal Pad For RDRAM Memory Modules Company Profile Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. The TIF100-25-11S Series thermally conductive...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness
Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness The TIF100-40-14S Series is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat...
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City
Customerized Ultra Soft 35 Shore00 1.5W Pink Thermal Conductive Gap Filler Pad 2.34 G/Cc For Memory Modules
Customerized ultra soft 35 shore00 1.5W pink thermal conductive gap filler for Memory Modules The TIF100-14E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements...